LCMXO1200E-3BN256C

Lattice Semiconductor Corporation LCMXO1200E-3BN256C

Part Number:
LCMXO1200E-3BN256C
Manufacturer:
Lattice Semiconductor Corporation
Ventron No:
3127498-LCMXO1200E-3BN256C
Description:
IC FPGA 211 I/O 256CABGA
ECAD Model:
Datasheet:
LCMXO1200E-3BN256C

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Specifications
Lattice Semiconductor Corporation LCMXO1200E-3BN256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LCMXO1200E-3BN256C.
  • Factory Lead Time
    8 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LFBGA, CSPBGA
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2000
  • Series
    MachXO
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.8mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    LCMXO1200
  • Pin Count
    256
  • JESD-30 Code
    S-PBGA-B256
  • Number of Outputs
    211
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Operating Supply Current
    18mA
  • Number of I/O
    211
  • Nominal Supply Current
    18mA
  • Memory Type
    SRAM
  • Clock Frequency
    420MHz
  • Propagation Delay
    5.1 ns
  • Number of Inputs
    211
  • Programmable Logic Type
    FLASH PLD
  • Number of Logic Elements/Cells
    1200
  • Total RAM Bits
    9421
  • Number of LABs/CLBs
    150
  • Output Function
    MACROCELL
  • Number of Macro Cells
    600
  • Number of Dedicated Inputs
    7
  • Height Seated (Max)
    1.7mm
  • Length
    14mm
  • Width
    14mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
LCMXO1200E-3BN256C Overview
This specific component is manufactured by Lattice Semiconductor Corporation and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It was first released in 2000 and has a Terminal Finish of Tin/Silver/Copper (Sn/Ag/Cu). It operates using CMOS technology and requires a voltage supply of 1.14V~1.26V. The maximum reflow temperature for this chip is 40 degrees Celsius and it has a propagation delay of 5.1 nanoseconds. Its programmable logic type is FLASH PLD and it contains 600 macro cells. The maximum height when seated is 1.7mm and it has a width of 14mm.

LCMXO1200E-3BN256C Features
211 I/Os
Up to 9421 RAM bits

LCMXO1200E-3BN256C Applications
There are a lot of Lattice Semiconductor Corporation LCMXO1200E-3BN256C FPGAs applications.

Medical Applications
Radar and Sensors
Automotive
Data Mining
Camera time adjustments
Telecommunication
ADAS
Aerospace and Defense
Development Boards and Shields for Microcontrollers
Automotive advanced driver assistance systems (ADAS)
LCMXO1200E-3BN256C More Descriptions
1.2V V 1.7mm mm FPGAs MachXO Series 256-LFBGA, CSPBGA 18mA mA 0.8mm mm 256
Lattice Machxo ; 1200 Luts; 1.2V Rohs Compliant: Yes |Lattice Semiconductor LCMXO1200E-3BN256C
FPGA - Field Programmable Gate Array 1200 LUTs 211 I/O 1.2V -3 SPD
1200 LUTs211 I/O 1.2V -3 Speed
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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