Lattice Semiconductor Corporation LC4384B-75FN256I

LC4384B-75FN256I Overview
The 256-BGA package, also known as the 256-ball grid array, is a type of packaging used for integrated circuits. It is designed to provide a high level of protection for the delicate circuitry inside. The package is specifically designed to house the JESD-609 code, which is a set of standards for the handling and transport of electronic components. The package has a pin count of 256, making it suitable for complex and high-performance applications. The maximum supply voltage for this package is 2.7V, while the operating supply current is 13.5mA. The internal voltage supply ranges from 2.3V to 2.7V, ensuring stable and efficient operation. With 24 logic elements/blocks and a seated height of 2.1mm, this package is compact and efficient, with a length of 17mm.

LC4384B-75FN256I Features
256-BGA package
192 I/Os
The operating temperature of -40°C~105°C TJ
256 pin count

LC4384B-75FN256I Applications
There are a lot of Lattice Semiconductor Corporation LC4384B-75FN256I CPLDs applications.

Reset swapping
PULSE WIDTH MODULATION (PWM)
Page register
I/O PORTS (MCU MODULE)
Custom state machines
STANDARD SERIAL INTERFACE UART
State machine control
Network Interface Card (NIC) and Host Bus Adapter (HBA)
Boolean function generators
Interface bridging