Altera EPM7512AEFC256-7

EPM7512AEFC256-7 Overview
The package or case of this component is a 256-BGA, which stands for Ball Grid Array. It is a type of surface mount packaging that uses a grid of solder balls to connect the component to a circuit board. The JESD-609 code for this particular component is e0, which indicates its moisture sensitivity level. The part status is currently active, meaning it is currently in production and available for purchase. The supply voltage for this component is 3.3V, which is the amount of voltage required for it to function properly. The base part number is EPM7512, which identifies the specific model of this component. It has a clock frequency of 116.3MHz, which is the speed at which it operates. The propagation delay, or the time it takes for a signal to travel through the component, is 7.5 nanoseconds. The maximum height when seated is 2.1mm, and the length and width of the component are both 17mm.

EPM7512AEFC256-7 Features
256-BGA package
212 I/Os
The operating temperature of 0°C~70°C TA
2.5/3.33.3V power supplies

EPM7512AEFC256-7 Applications
There are a lot of Intel EPM7512AEFC256-7 CPLDs applications.

Field programmable gate
Programmable power management
Timing control
Preset swapping
Address decoders
Software-Driven Hardware Configuration
SUPERVISORY FUNCTION (LVD AND WATCHDOG)
Power up sequencing
I/O expansion
USB Bus