Altera EP4SGX360FH29C3N

EP4SGX360FH29C3N Overview
Surface Mount technology is widely used in the electronics industry, and it has become an essential part of modern circuit board assembly. One of the reasons for its popularity is its active status, meaning it is readily available for use in various applications. The terminal finish of this technology is Tin/Silver/Copper, also known as Sn/Ag/Cu, which provides excellent conductivity and durability. The voltage supply for this technology ranges from 0.87V to 0.93V, making it suitable for a wide range of electronic devices. The terminal position is located at the bottom, which allows for efficient and compact placement on the circuit board. With a peak reflow temperature of 245 degrees Celsius and a maximum reflow time of 40 seconds, this technology can withstand high-temperature processes during assembly. It also boasts an impressive 289 inputs and 353,600 logic elements/cells, making it a powerful tool for complex electronic designs. Additionally, its height when seated is only 3.4mm, making it a compact and space-saving option for electronic devices. Overall, Surface Mount technology is a highly versatile and efficient option for modern electronics.

EP4SGX360FH29C3N Features
289 I/Os
Up to 23105536 RAM bits

EP4SGX360FH29C3N Applications
There are a lot of Intel EP4SGX360FH29C3N FPGAs applications.

Bioinformatics
Automotive
ASIC prototyping
Software-defined radios
OpenCL
Medical Applications
Camera time adjustments
DO-254
Audio
Aerospace and Defense