Altera EP4CE115F23I7N

EP4CE115F23I7N Overview
The package or case of this electronic component is a 484-BGA, which refers to the type of packaging used for this particular device. It is designed to have 484 terminations, which are the points where the component connects to a circuit board. The JESD-609 code for this package is e1, indicating its size and shape. The ECCN code, 3A001.A.7.A, is used for export control purposes and classifies this component as a high-tech item. The HTS code, 8542.39.00.01, is used for import and customs purposes and identifies this component as a semiconductor device. The terminal position of this package is on the bottom, and the terminal pitch, or distance between terminals, is 1mm. The maximum reflow temperature for this package is 40 seconds, as indicated by the reflow temperature-max (s) specification. The JESD-30 code for this package is S-PBGA-B484, which provides additional information about its size and shape. Lastly, this package contains a total of 114480 logic elements or cells, which are the basic building blocks of digital circuits.

EP4CE115F23I7N Features
280 I/Os
Up to 3981312 RAM bits

EP4CE115F23I7N Applications
There are a lot of Intel EP4CE115F23I7N FPGAs applications.

Distributed Monetary Systems
Automotive Applications
Image processing
Solar Energy
Data center hardware accelerators
High Performance Computing
Industrial Ethernet
Voice recognition
ASIC prototyping
Cryptography