EP2AGX45DF25I3

Altera EP2AGX45DF25I3

Part Number:
EP2AGX45DF25I3
Manufacturer:
Altera
Ventron No:
3134196-EP2AGX45DF25I3
Description:
IC FPGA 252 I/O 572FBGA
ECAD Model:
Datasheet:
Arria II Device Handbook Vol 3 Arria II Device Handbook Vol 1

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Specifications
Altera EP2AGX45DF25I3 technical specifications, attributes, parameters and parts with similar specifications to Altera EP2AGX45DF25I3.
  • Mounting Type
    Surface Mount
  • Package / Case
    572-BGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    Arria II GX
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Terminal Finish
    TIN LEAD
  • Voltage - Supply
    0.87V~0.93V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    EP2AGX45
  • Number of I/O
    252
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    42959
  • Total RAM Bits
    3517440
  • Number of LABs/CLBs
    1805
  • RoHS Status
    Non-RoHS Compliant
Description
EP2AGX45DF25I3 Overview
The package that contains this software is called 572-BGA, FCBGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 252 I/Os for better data transfer. In order to construct a fundamental building block, 42959 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 0.87V~0.93V battery. There are many types of FPGAs in the Arria II GX series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 3517440. If you are looking for related parts, you can use the base part number EP2AGX45 as a starting point. 1805 LABs/CLBs are configured on this FPGA.

EP2AGX45DF25I3 Features
252 I/Os
Up to 3517440 RAM bits


EP2AGX45DF25I3 Applications
There are a lot of Intel
EP2AGX45DF25I3 FPGAs applications.


Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
EP2AGX45DF25I3 More Descriptions
Field Programmable Gate Array, 42959-Cell, PBGA572
IC FPGA 252 I/O 572FBGA
Product Comparison
The three parts on the right have similar specifications to EP2AGX45DF25I3.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    Voltage - Supply
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Number of I/O
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    RoHS Status
    Supplier Device Package
    Number of Gates
    Surface Mount
    Number of Terminations
    ECCN Code
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Propagation Delay
    Number of Inputs
    Output Function
    Length
    Height Seated (Max)
    Width
    Pbfree Code
    Pin Count
    Organization
    View Compare
  • EP2AGX45DF25I3
    EP2AGX45DF25I3
    Surface Mount
    572-BGA, FCBGA
    -40°C~100°C TJ
    Tray
    Arria II GX
    e0
    Obsolete
    3 (168 Hours)
    TIN LEAD
    0.87V~0.93V
    NOT SPECIFIED
    NOT SPECIFIED
    EP2AGX45
    252
    FIELD PROGRAMMABLE GATE ARRAY
    42959
    3517440
    1805
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • EP2A70F1020C9
    Surface Mount
    1020-BBGA
    0°C~85°C TJ
    Tray
    APEX II
    -
    Obsolete
    3 (168 Hours)
    -
    1.425V~1.575V
    -
    -
    -
    735
    -
    67200
    1146880
    6720
    -
    1020-FBGA (33x33)
    5250000
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • EP2A25F672I8
    Surface Mount
    672-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    APEX II
    e0
    Obsolete
    3 (168 Hours)
    Tin/Lead (Sn/Pb)
    1.425V~1.575V
    220
    30
    EP2A25
    492
    LOADABLE PLD
    24320
    622592
    2430
    Non-RoHS Compliant
    -
    2750000
    YES
    672
    3A001.A.7.A
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    1.5V
    1mm
    compliant
    S-PBGA-B672
    480
    Not Qualified
    1.51.5/3.3V
    1.94 ns
    480
    MACROCELL
    27mm
    2.1mm
    27mm
    -
    -
    -
  • EP2A40B724C9
    Surface Mount
    724-BBGA, FCBGA
    0°C~85°C TJ
    Tray
    APEX II
    -
    Obsolete
    3 (168 Hours)
    NOT SPECIFIED
    1.425V~1.575V
    NOT SPECIFIED
    NOT SPECIFIED
    -
    540
    LOADABLE PLD
    38400
    655360
    3840
    Non-RoHS Compliant
    -
    3000000
    YES
    724
    -
    -
    -
    CMOS
    BOTTOM
    BALL
    1.5V
    1.27mm
    -
    S-PBGA-B724
    -
    COMMERCIAL
    -
    2.05 ns
    -
    MACROCELL
    35mm
    3.5mm
    35mm
    yes
    724
    536 I/O
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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