Altera EP2AGX125EF35C6N

Name: EP2AGX125EF35C6N
Brand: Altera
SKU: 3821667-EP2AGX125EF35C6N
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: EP2AGX125EF35C6N

Manufacturer:: Altera

Ventron No:: 3821667-EP2AGX125EF35C6N

Description:: IC FPGA 452 I/O 1152FBGA

ECAD Model:

Datasheet:: EP2AGX125EF35C6N

Specifications

Altera EP2AGX125EF35C6N technical specifications, attributes, parameters and parts with similar specifications to Altera EP2AGX125EF35C6N.

Mounting Type
Surface Mount
Package / Case
1152-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
Arria II GX
JESD-609 Code
e1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
ECCN Code
3A991
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
0.87V~0.93V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
0.9V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
40
Base Part Number
EP2AGX125
JESD-30 Code
S-PBGA-B1152
Number of Outputs
452
Qualification Status
Not Qualified
Power Supplies
0.91.2/3.31.52.5V
Number of I/O
452
Clock Frequency
500MHz
Number of Inputs
452
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
118143
Total RAM Bits
8315904
Number of LABs/CLBs
4964
Height Seated (Max)
2.6mm
Length
35mm
Width
35mm
RoHS Status
RoHS Compliant

Description

EP2AGX125EF35C6N Overview
Surface Mount is a type of electronic packaging that is commonly used in the manufacturing of integrated circuits. In this particular case, the packaging for the device is a tray. The technology used in this device is CMOS, which stands for Complementary Metal-Oxide-Semiconductor. The voltage supply for this device ranges from 0.87V to 0.93V. The terminal position for this device is at the bottom, making it easy to connect to other components. The peak reflow temperature for this device is 245 degrees Celsius, while the maximum reflow temperature is 40 seconds. The JESD-30 code for this device is S-PBGA-B1152, indicating the type of packaging and the number of pins. Currently, this device is not qualified, meaning it has not passed all necessary tests and certifications. Lastly, this device is a field programmable gate array, which allows for customization and programmability for specific applications.

EP2AGX125EF35C6N Features
452 I/Os
Up to 8315904 RAM bits

EP2AGX125EF35C6N Applications
There are a lot of Intel EP2AGX125EF35C6N FPGAs applications.

Data Center
Solar Energy
Data center hardware accelerators
Automotive driver's assistance
Automotive
DO-254
Defense Applications
Enterprise networking
Software-defined radio
Aircraft navigation

EP2AGX125EF35C6N More Descriptions

FPGA Arria® II GX Family 118143 Cells 400MHz 40nm Technology 0.9V 1152-Pin FC-FBGA
Field Programmable Gate Array, 118143-Cell, PBGA1152
CMOS OTHER 2006 RoHS Compliant FPGA 85C 1015.1kB 400MHz 930mV
IC FPGA 452 I/O 1152FBGA Arria II GX

Product Comparison

The three parts on the right have similar specifications to EP2AGX125EF35C6N.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Surface Mount

Operating Temperature

Packaging

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

ECCN Code

Terminal Finish

HTS Code

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

JESD-30 Code

Number of Outputs

Qualification Status

Power Supplies

Number of I/O

Clock Frequency

Number of Inputs

Programmable Logic Type

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Height Seated (Max)

Length

Width

RoHS Status

Supplier Device Package

Number of Gates

Pbfree Code

Number of Terminations

Time@Peak Reflow Temperature-Max (s)

Pin Count

Propagation Delay

Organization

Output Function

Number of Terminals

Operating Temperature (Max)

Supply Voltage-Max (Vsup)

Temperature Grade

Supply Voltage-Min (Vsup)

Seated Height-Max

View Compare
EP2AGX125EF35C6N

Altera

Surface Mount

1152-BBGA, FCBGA

YES

0°C~85°C TJ

Tray

Arria II GX

e1

Obsolete

3 (168 Hours)

3A991

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

0.87V~0.93V

BOTTOM

BALL

245

0.9V

1mm

40

EP2AGX125

S-PBGA-B1152

452

Not Qualified

0.91.2/3.31.52.5V

452

500MHz

452

FIELD PROGRAMMABLE GATE ARRAY

118143

8315904

4964

2.6mm

35mm

35mm

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
EP2A15B724C9

Altera

Surface Mount

724-BBGA, FCBGA

-

0°C~85°C TJ

Tray

APEX II

-

Obsolete

3 (168 Hours)

-

-

-

-

-

1.425V~1.575V

-

-

-

-

-

-

EP2A15

-

-

-

-

492

-

-

-

16640

425984

1664

-

-

-

-

724-BGA (35x35)

1900000

-

-

-

-

-

-

-

-

-

-

-

-

-

EP2AGX125EF35C6N vs EP2A15B724C9
EP2A40B724I8

Altera

Surface Mount

724-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

APEX II

e0

Obsolete

3 (168 Hours)

-

TIN LEAD

-

-

CMOS

1.425V~1.575V

BOTTOM

BALL

NOT SPECIFIED

1.5V

1.27mm

-

-

S-PBGA-B724

-

COMMERCIAL

-

540

-

-

LOADABLE PLD

38400

655360

3840

3.5mm

35mm

35mm

Non-RoHS Compliant

-

3000000

no

724

NOT SPECIFIED

724

1.7 ns

536 I/O

MACROCELL

-

-

-

-

-

-

EP2AGX125EF35C6N vs EP2A40B724I8
EP2A25B724C7

Altera

-

-

YES

-

-

-

e0

-

NOT SPECIFIED

-

TIN LEAD

-

-

CMOS

-

BOTTOM

BALL

220

1.5V

1.27mm

-

-

S-PBGA-B724

-

COMMERCIAL

-

536

-

-

LOADABLE PLD

-

-

-

-

35mm

35mm

Non-RoHS Compliant

-

-

no

-

30

724

1.69 ns

536 I/O

MACROCELL

724

85°C

1.575V

OTHER

1.425V

3.5mm

EP2AGX125EF35C6N vs EP2A25B724C7