EP2AGX125DF25I3

Altera EP2AGX125DF25I3

Part Number:
EP2AGX125DF25I3
Manufacturer:
Altera
Ventron No:
3134195-EP2AGX125DF25I3
Description:
IC FPGA 260 I/O 572FBGA
ECAD Model:
Datasheet:
Arria II Device Handbook Vol 3 Arria II Device Handbook Vol 1

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Specifications
Altera EP2AGX125DF25I3 technical specifications, attributes, parameters and parts with similar specifications to Altera EP2AGX125DF25I3.
  • Mounting Type
    Surface Mount
  • Package / Case
    572-BGA, FCBGA
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    Arria II GX
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Terminal Finish
    TIN LEAD
  • Voltage - Supply
    0.87V~0.93V
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    EP2AGX125
  • Number of I/O
    260
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    118143
  • Total RAM Bits
    8315904
  • Number of LABs/CLBs
    4964
  • RoHS Status
    Non-RoHS Compliant
Description
EP2AGX125DF25I3 Overview
In the 572-BGA, FCBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 260 I/O ports for more coherent data transfer. To form a fundamental building block, there are 118143 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.87V~0.93V-volt supply voltage required for the device to operate. The Arria II GX Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 8315904 bFpga chipss. You can find related parts by using the part number EP2AGX125, which is its base part number. A total of 4964 LABs/CLBs are included in this FPGA.

EP2AGX125DF25I3 Features
260 I/Os
Up to 8315904 RAM bits


EP2AGX125DF25I3 Applications
There are a lot of Intel
EP2AGX125DF25I3 FPGAs applications.


Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
EP2AGX125DF25I3 More Descriptions
2006 Non-RoHS Compliant e0 FIELD PROGRAMMABLE GATE ARRAY FPGA 100C
IC FPGA 260 I/O 572FBGA Arria II GX
IC FPGA 260 I/O 572FBGA
Product Comparison
The three parts on the right have similar specifications to EP2AGX125DF25I3.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    Voltage - Supply
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Number of I/O
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    RoHS Status
    Surface Mount
    Pbfree Code
    Number of Terminations
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    Terminal Pitch
    Pin Count
    JESD-30 Code
    Qualification Status
    Propagation Delay
    Organization
    Number of Gates
    Output Function
    Length
    Height Seated (Max)
    Width
    Number of Terminals
    Operating Temperature (Max)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Seated Height-Max
    View Compare
  • EP2AGX125DF25I3
    EP2AGX125DF25I3
    Surface Mount
    572-BGA, FCBGA
    -40°C~100°C TJ
    Tray
    Arria II GX
    e0
    Obsolete
    3 (168 Hours)
    TIN LEAD
    0.87V~0.93V
    NOT SPECIFIED
    NOT SPECIFIED
    EP2AGX125
    260
    FIELD PROGRAMMABLE GATE ARRAY
    118143
    8315904
    4964
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • EP2A40B724I8
    Surface Mount
    724-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    APEX II
    e0
    Obsolete
    3 (168 Hours)
    TIN LEAD
    1.425V~1.575V
    NOT SPECIFIED
    NOT SPECIFIED
    -
    540
    LOADABLE PLD
    38400
    655360
    3840
    Non-RoHS Compliant
    YES
    no
    724
    CMOS
    BOTTOM
    BALL
    1.5V
    1.27mm
    724
    S-PBGA-B724
    COMMERCIAL
    1.7 ns
    536 I/O
    3000000
    MACROCELL
    35mm
    3.5mm
    35mm
    -
    -
    -
    -
    -
    -
  • EP2A25B724C7
    -
    -
    -
    -
    -
    e0
    -
    NOT SPECIFIED
    TIN LEAD
    -
    220
    30
    -
    536
    LOADABLE PLD
    -
    -
    -
    Non-RoHS Compliant
    YES
    no
    -
    CMOS
    BOTTOM
    BALL
    1.5V
    1.27mm
    724
    S-PBGA-B724
    COMMERCIAL
    1.69 ns
    536 I/O
    -
    MACROCELL
    35mm
    -
    35mm
    724
    85°C
    1.575V
    OTHER
    1.425V
    3.5mm
  • EP2A40B724C9
    Surface Mount
    724-BBGA, FCBGA
    0°C~85°C TJ
    Tray
    APEX II
    -
    Obsolete
    3 (168 Hours)
    NOT SPECIFIED
    1.425V~1.575V
    NOT SPECIFIED
    NOT SPECIFIED
    -
    540
    LOADABLE PLD
    38400
    655360
    3840
    Non-RoHS Compliant
    YES
    yes
    724
    CMOS
    BOTTOM
    BALL
    1.5V
    1.27mm
    724
    S-PBGA-B724
    COMMERCIAL
    2.05 ns
    536 I/O
    3000000
    MACROCELL
    35mm
    3.5mm
    35mm
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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