Altera EP2AGX125DF25I3
- Part Number:
- EP2AGX125DF25I3
- Manufacturer:
- Altera
- Ventron No:
- 3134195-EP2AGX125DF25I3
- Description:
- IC FPGA 260 I/O 572FBGA
Altera EP2AGX125DF25I3 technical specifications, attributes, parameters and parts with similar specifications to Altera EP2AGX125DF25I3.
- Mounting TypeSurface Mount
- Package / Case572-BGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesArria II GX
- JESD-609 Codee0
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Terminal FinishTIN LEAD
- Voltage - Supply0.87V~0.93V
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberEP2AGX125
- Number of I/O260
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells118143
- Total RAM Bits8315904
- Number of LABs/CLBs4964
- RoHS StatusNon-RoHS Compliant
EP2AGX125DF25I3 Overview
In the 572-BGA, FCBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 260 I/O ports for more coherent data transfer. To form a fundamental building block, there are 118143 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.87V~0.93V-volt supply voltage required for the device to operate. The Arria II GX Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 8315904 bFpga chipss. You can find related parts by using the part number EP2AGX125, which is its base part number. A total of 4964 LABs/CLBs are included in this FPGA.
EP2AGX125DF25I3 Features
260 I/Os
Up to 8315904 RAM bits
EP2AGX125DF25I3 Applications
There are a lot of Intel
EP2AGX125DF25I3 FPGAs applications.
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
In the 572-BGA, FCBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 260 I/O ports for more coherent data transfer. To form a fundamental building block, there are 118143 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 0.87V~0.93V-volt supply voltage required for the device to operate. The Arria II GX Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 8315904 bFpga chipss. You can find related parts by using the part number EP2AGX125, which is its base part number. A total of 4964 LABs/CLBs are included in this FPGA.
EP2AGX125DF25I3 Features
260 I/Os
Up to 8315904 RAM bits
EP2AGX125DF25I3 Applications
There are a lot of Intel
EP2AGX125DF25I3 FPGAs applications.
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
EP2AGX125DF25I3 More Descriptions
2006 Non-RoHS Compliant e0 FIELD PROGRAMMABLE GATE ARRAY FPGA 100C
IC FPGA 260 I/O 572FBGA Arria II GX
IC FPGA 260 I/O 572FBGA
IC FPGA 260 I/O 572FBGA Arria II GX
IC FPGA 260 I/O 572FBGA
The three parts on the right have similar specifications to EP2AGX125DF25I3.
-
ImagePart NumberManufacturerMounting TypePackage / CaseOperating TemperaturePackagingSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Terminal FinishVoltage - SupplyPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)Base Part NumberNumber of I/OProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsRoHS StatusSurface MountPbfree CodeNumber of TerminationsTechnologyTerminal PositionTerminal FormSupply VoltageTerminal PitchPin CountJESD-30 CodeQualification StatusPropagation DelayOrganizationNumber of GatesOutput FunctionLengthHeight Seated (Max)WidthNumber of TerminalsOperating Temperature (Max)Supply Voltage-Max (Vsup)Temperature GradeSupply Voltage-Min (Vsup)Seated Height-MaxView Compare
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EP2AGX125DF25I3Surface Mount572-BGA, FCBGA-40°C~100°C TJTrayArria II GXe0Obsolete3 (168 Hours)TIN LEAD0.87V~0.93VNOT SPECIFIEDNOT SPECIFIEDEP2AGX125260FIELD PROGRAMMABLE GATE ARRAY11814383159044964Non-RoHS Compliant-------------------------
-
Surface Mount724-BBGA, FCBGA-40°C~100°C TJTrayAPEX IIe0Obsolete3 (168 Hours)TIN LEAD1.425V~1.575VNOT SPECIFIEDNOT SPECIFIED-540LOADABLE PLD384006553603840Non-RoHS CompliantYESno724CMOSBOTTOMBALL1.5V1.27mm724S-PBGA-B724COMMERCIAL1.7 ns536 I/O3000000MACROCELL35mm3.5mm35mm------
-
-----e0-NOT SPECIFIEDTIN LEAD-22030-536LOADABLE PLD---Non-RoHS CompliantYESno-CMOSBOTTOMBALL1.5V1.27mm724S-PBGA-B724COMMERCIAL1.69 ns536 I/O-MACROCELL35mm-35mm72485°C1.575VOTHER1.425V3.5mm
-
Surface Mount724-BBGA, FCBGA0°C~85°C TJTrayAPEX II-Obsolete3 (168 Hours)NOT SPECIFIED1.425V~1.575VNOT SPECIFIEDNOT SPECIFIED-540LOADABLE PLD384006553603840Non-RoHS CompliantYESyes724CMOSBOTTOMBALL1.5V1.27mm724S-PBGA-B724COMMERCIAL2.05 ns536 I/O3000000MACROCELL35mm3.5mm35mm------
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