EP2A70F1508C9

Altera EP2A70F1508C9

Part Number:
EP2A70F1508C9
Manufacturer:
Altera
Ventron No:
3640255-EP2A70F1508C9
Description:
IC FPGA 1060 I/O 1508FBGA
ECAD Model:
Datasheet:
APEX II Datasheet

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Specifications
Altera EP2A70F1508C9 technical specifications, attributes, parameters and parts with similar specifications to Altera EP2A70F1508C9.
  • Mounting Type
    Surface Mount
  • Package / Case
    1508-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Series
    APEX II
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Terminal Finish
    TIN LEAD
  • Technology
    CMOS
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1.5V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B1508
  • Qualification Status
    COMMERCIAL
  • Number of I/O
    1060
  • Propagation Delay
    2.87 ns
  • Programmable Logic Type
    LOADABLE PLD
  • Number of Logic Elements/Cells
    67200
  • Total RAM Bits
    1146880
  • Number of Gates
    5250000
  • Number of LABs/CLBs
    6720
  • Output Function
    MACROCELL
  • Length
    40mm
  • Height Seated (Max)
    3.5mm
  • Width
    40mm
  • RoHS Status
    Non-RoHS Compliant
Description
EP2A70F1508C9 Overview
A 1508-BBGA, FCBGA package contains it, and it is available for download. There are LOADABLE PLD transistors in this type of FPGA. Its 1060 I/Os help it transfer data more efficiently. A fundamental building block contains 67200 logic elements or cells. Power is provided by a 1.5V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 1.425V~1.575V and uses a battery to supply power. FPGAs belonging to the APEX II series are a type of FPGA that belong to the APEX II series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. A model of this FPGA is contained in Tray for the purpose of saving space. Having a RAM bit size of 1146880 means that this device will offer you a lot of memory. 6720 LABs/CLBs are integrated into this FPGA. 5250000 gates make up the basic block of its construction.

EP2A70F1508C9 Features
1060 I/Os
Up to 1146880 RAM bits


EP2A70F1508C9 Applications
There are a lot of Rochester Electronics, LLC
EP2A70F1508C9 FPGAs applications.


Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
Distributed Monetary Systems
EP2A70F1508C9 More Descriptions
IC FPGA 1060 I/O 1508FBGA APEX II
MACROCELL CMOS OTHER 1998 FPGA 85C 140kB 2.87ns 1.425V
Loadable PLD, 2.87ns, CMOS, PBGA1508
APEX II Programmable Logic Device
Product Comparison
The three parts on the right have similar specifications to EP2A70F1508C9.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Qualification Status
    Number of I/O
    Propagation Delay
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of Gates
    Number of LABs/CLBs
    Output Function
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Supplier Device Package
    Number of Terminations
    Pin Count
    Organization
    Number of Terminals
    Operating Temperature (Max)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Seated Height-Max
    View Compare
  • EP2A70F1508C9
    EP2A70F1508C9
    Surface Mount
    1508-BBGA, FCBGA
    YES
    0°C~85°C TJ
    Tray
    APEX II
    e0
    no
    Obsolete
    3 (168 Hours)
    TIN LEAD
    CMOS
    1.425V~1.575V
    BOTTOM
    BALL
    245
    1.5V
    1mm
    NOT SPECIFIED
    S-PBGA-B1508
    COMMERCIAL
    1060
    2.87 ns
    LOADABLE PLD
    67200
    1146880
    5250000
    6720
    MACROCELL
    40mm
    3.5mm
    40mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • EP2A70F1020C7
    Surface Mount
    1020-BBGA
    -
    0°C~85°C TJ
    Tray
    APEX II
    -
    -
    Obsolete
    3 (168 Hours)
    -
    -
    1.425V~1.575V
    -
    -
    -
    -
    -
    -
    -
    -
    735
    -
    -
    67200
    1146880
    5250000
    6720
    -
    -
    -
    -
    -
    1020-FBGA (33x33)
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • EP2A40B724I8
    Surface Mount
    724-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    APEX II
    e0
    no
    Obsolete
    3 (168 Hours)
    TIN LEAD
    CMOS
    1.425V~1.575V
    BOTTOM
    BALL
    NOT SPECIFIED
    1.5V
    1.27mm
    NOT SPECIFIED
    S-PBGA-B724
    COMMERCIAL
    540
    1.7 ns
    LOADABLE PLD
    38400
    655360
    3000000
    3840
    MACROCELL
    35mm
    3.5mm
    35mm
    Non-RoHS Compliant
    -
    724
    724
    536 I/O
    -
    -
    -
    -
    -
    -
  • EP2A25B724C7
    -
    -
    YES
    -
    -
    -
    e0
    no
    -
    NOT SPECIFIED
    TIN LEAD
    CMOS
    -
    BOTTOM
    BALL
    220
    1.5V
    1.27mm
    30
    S-PBGA-B724
    COMMERCIAL
    536
    1.69 ns
    LOADABLE PLD
    -
    -
    -
    -
    MACROCELL
    35mm
    -
    35mm
    Non-RoHS Compliant
    -
    -
    724
    536 I/O
    724
    85°C
    1.575V
    OTHER
    1.425V
    3.5mm
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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