DSPB56374AF

NXP USA Inc. DSPB56374AF

Part Number:
DSPB56374AF
Manufacturer:
NXP USA Inc.
Ventron No:
3631950-DSPB56374AF
Description:
IC DSP 24BIT 150MHZ 80-LQFP
ECAD Model:
Datasheet:
DSPB56374AF

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Specifications
NXP USA Inc. DSPB56374AF technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. DSPB56374AF.
  • Mounting Type
    Surface Mount
  • Package / Case
    80-LQFP
  • Surface Mount
    YES
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Tray
  • Series
    DSP56K/Symphony
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    80
  • Terminal Finish
    MATTE TIN
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.25V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    40
  • Pin Count
    80
  • JESD-30 Code
    S-PQFP-G80
  • Qualification Status
    COMMERCIAL
  • Supply Voltage-Max (Vsup)
    1.3V
  • Supply Voltage-Min (Vsup)
    1.2V
  • Interface
    Host Interface, I2C, SAI, SPI
  • Clock Frequency
    149.9MHz
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • Format
    FIXED POINT
  • Voltage - I/O
    3.30V
  • Barrel Shifter
    YES
  • Internal Bus Architecture
    MULTIPLE
  • Non-Volatile Memory
    ROM (84kB)
  • Voltage - Core
    1.25V
  • On Chip Data RAM
    54kB
  • Clock Rate
    150MHz
  • Height Seated (Max)
    1.6mm
  • Length
    14mm
  • Width
    14mm
  • RoHS Status
    ROHS3 Compliant
Description
DSPB56374AF Overview
The NXP USA Inc. produces this chip, which falls under the Embedded - DSP (Digital Signal Processors) category. It has a Surface Mount mounting type and a 80-LQFP package/case. The operating temperature range is 0°C~70°C TA and it has 80 terminations. The technology used is CMOS and the peak reflow temperature is 260°C. The terminal pitch is 0.65mm and it has a COMMERCIAL qualification status. The maximum seated height is 1.6mm and the width is 14mm.

DSPB56374AF Features
Supplied in the 80-LQFP package

DSPB56374AF Applications
There are a lot of Rochester Electronics, LLC DSPB56374AF DSP applications.

Instrument modeling
Consumer electronic gadgets
Biomedical engineering
Medical imaging
Automobiles
Electronic information engineering
Signal processing for telecommunications
Tomography technology
Speech processing
Other sensor array processing
DSPB56374AF More Descriptions
DSP56K/Symphony MULTIPLE Surface Mount Audio Processor DSP 0C~70C TA ROM (84kB) 149.9MHz 14mm
DSP Fixed-Point 24-Bit 150MHz 150MIPS 80-Pin LQFP Tray
Digital Signal Processor IC; Series:DSP56300; DSP Type:Static CMOS Technology; Core Frequency Typ:150MHz; Memory Size, RAM:18KB; Cache Memory On Chip L1/L2:0KB; Interface:I2C, SPI; Supply Voltage Min:1.2V; Supply Voltage Max:1.3V ;RoHS Compliant: Yes
DSP, 24BIT, 18K RAM, 150MHZ, 80LQFP; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2011); Core Frequency Typ:150MHz; DSP Type:Core; Interface Type:ESAI, SHI; MMAC:150; No. of Pins:80; Operating Temperature Range:-40°C to 105°C; Package / Case:LQFP; RAM Memory Size:54KB; Series:DSPB56300; Supply Voltage Max:3.46V; Supply Voltage Min:3.14V; Termination Type:SMD
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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