NXP USA Inc. DSP56311VL150
- Part Number:
- DSP56311VL150
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3630864-DSP56311VL150
- Description:
- IC DSP 24BIT FIXED POINT 196-BGA
- Datasheet:
- DSP56311
NXP USA Inc. DSP56311VL150 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. DSP56311VL150.
- Mounting TypeSurface Mount
- Package / Case196-LBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published1996
- SeriesDSP56K/Symphony
- JESD-609 Codee1
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations196
- ECCN Code3A991.A.2
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeatureALSO REQUIRES 3.3V SUPPLY
- HTS Code8542.31.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.8V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)40
- Base Part NumberDSP56311
- JESD-30 CodeS-PBGA-B196
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.9V
- Supply Voltage-Min (Vsup)1.7V
- InterfaceHost Interface, SSI, SCI
- Clock Frequency150MHz
- Address Bus Width18
- Boundary ScanYES
- Low Power ModeYES
- External Data Bus Width24
- Voltage - I/O3.30V
- Barrel ShifterYES
- Internal Bus ArchitectureMULTIPLE
- Non-Volatile MemoryROM (576B)
- Voltage - Core1.80V
- On Chip Data RAM384kB
- Clock Rate150MHz
- Height Seated (Max)1.6mm
- Length15mm
- Width15mm
- RoHS StatusROHS3 Compliant
DSP56311VL150 Overview
This product is packaged in a tray and has a terminal finish of Tin/Silver/Copper (Sn/Ag/Cu). The peak reflow temperature is 260 degrees Celsius and the maximum reflow temperature is 40 seconds. Its JESD-30 code is S-PBGA-B196 and it has an address bus width of 18 and an external data bus width of 24. The non-volatile memory is ROM with a capacity of 576B and it also has 384kB of on chip data RAM. Its clock rate is 150MHz.
DSP56311VL150 Features
Supplied in the 196-LBGA package
DSP56311VL150 Applications
There are a lot of NXP USA Inc. DSP56311VL150 DSP applications.
Audio
Infrared
Other sensor array processing
Streaming videos
Fourier transform
Audio signal
Compression of videos
Machinery and equipment
Video coding, audio coding
Control systems
This product is packaged in a tray and has a terminal finish of Tin/Silver/Copper (Sn/Ag/Cu). The peak reflow temperature is 260 degrees Celsius and the maximum reflow temperature is 40 seconds. Its JESD-30 code is S-PBGA-B196 and it has an address bus width of 18 and an external data bus width of 24. The non-volatile memory is ROM with a capacity of 576B and it also has 384kB of on chip data RAM. Its clock rate is 150MHz.
DSP56311VL150 Features
Supplied in the 196-LBGA package
DSP56311VL150 Applications
There are a lot of NXP USA Inc. DSP56311VL150 DSP applications.
Audio
Infrared
Other sensor array processing
Streaming videos
Fourier transform
Audio signal
Compression of videos
Machinery and equipment
Video coding, audio coding
Control systems
DSP56311VL150 More Descriptions
Digital Signal Processor, 24-Bit Size, 24-Ext Bit, 150MHz, CMOS, PBGA196
DSP Fixed-Point 24-Bit 150MHz 150MIPS 196-Pin MAP-BGA Tray
Digital Signal Processor (DSP) IC; Series:DSP56300; DSP Type:Fixed Point; MMAC:150; Core Frequency Typ:150MHz; Memory Size, RAM:384KB; Cache Memory On Chip L1/L2:1KB; External Memory Supported:SRAM, DRAM, SDRAM; Interface:ESSI, SCI ;RoHS Compliant: Yes
DSP Fixed-Point 24-Bit 150MHz 150MIPS 196-Pin MAP-BGA Tray
Digital Signal Processor (DSP) IC; Series:DSP56300; DSP Type:Fixed Point; MMAC:150; Core Frequency Typ:150MHz; Memory Size, RAM:384KB; Cache Memory On Chip L1/L2:1KB; External Memory Supported:SRAM, DRAM, SDRAM; Interface:ESSI, SCI ;RoHS Compliant: Yes
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