DSP56311VF150

NXP USA Inc. DSP56311VF150

Part Number:
DSP56311VF150
Manufacturer:
NXP USA Inc.
Ventron No:
3631172-DSP56311VF150
Description:
IC DSP 24BIT 150MHZ 196-BGA
ECAD Model:
Datasheet:
DSP56311

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Specifications
NXP USA Inc. DSP56311VF150 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. DSP56311VF150.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    196-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    1996
  • Series
    DSP56K/Symphony
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    196
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead/Silver (Sn/Pb/Ag)
  • Additional Feature
    ALSO REQUIRES 3.3V SUPPLY
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    220
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    DSP56311
  • JESD-30 Code
    S-PBGA-B196
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.9V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Interface
    Host Interface, SSI, SCI
  • Clock Frequency
    150MHz
  • Address Bus Width
    18
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    24
  • Voltage - I/O
    3.30V
  • Barrel Shifter
    YES
  • Internal Bus Architecture
    MULTIPLE
  • Non-Volatile Memory
    ROM (576B)
  • Voltage - Core
    1.80V
  • On Chip Data RAM
    384kB
  • Clock Rate
    150MHz
  • Height Seated (Max)
    1.6mm
  • Length
    15mm
  • Width
    15mm
  • RoHS Status
    Non-RoHS Compliant
Description
DSP56311VF150 Overview
This particular component is manufactured by NXP USA Inc. and falls under the category of Embedded - DSP (Digital Signal Processors). It is a chip that is designed to process digital signals and is commonly used in embedded systems. It is a surface mount type, meaning it can be directly mounted onto a circuit board. Its JESD-609 code is e0, indicating its specific characteristics and features. One of its additional features is that it requires a 3.3V power supply. The terminal form of this chip is in the shape of a ball. It can withstand a peak reflow temperature of 220 degrees Celsius. The maximum supply voltage it can handle is 1.9V, while the minimum is 1.7V. It has an address bus width of 18, which determines the number of bits that can be transmitted at a time. This chip also has a low power mode, making it energy-efficient. It has a width of 15mm, making it compact and suitable for smaller devices.

DSP56311VF150 Features
Supplied in the 196-LBGA package

DSP56311VF150 Applications
There are a lot of NXP USA Inc. DSP56311VF150 DSP applications.

Automobiles
Audio synthesis
Image signal processing
Audio signal
Tomography technology
Infrared
Real-time effects
Statistical signal processing
Remote sensing image processing technology
Instrument modeling
DSP56311VF150 More Descriptions
DSP Fixed-Point 24-Bit 150MHz 150MIPS 196-Pin MAP-BGA Tray
Digital Signal Processors & Controllers - DSP, DSC 150Mhz/300MMACS 150Mhz EFCOP
Digital Signal Processor IC; Series:DSP56300; DSP Type:Fixed Point; MMAC:150; Core Frequency Typ:150MHz; Memory Size, RAM:384KB; Cache Memory On Chip L1/L2:1KB; External Memory Supported:SRAM, DRAM, SDRAM; Interface:ESSI, SCI ;RoHS Compliant: No
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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