Maxim Integrated DS21Q552
- Part Number:
- DS21Q552
- Manufacturer:
- Maxim Integrated
- Ventron No:
- 3181106-DS21Q552
- Description:
- IC TXRX T1 QUAD 5V 256BGA
- Datasheet:
- DS21Q552
Maxim Integrated DS21Q552 technical specifications, attributes, parameters and parts with similar specifications to Maxim Integrated DS21Q552 .
- Mounting TypeSurface Mount
- Package / Case256-BGA
- Surface MountYES
- PackagingTray
- Published1998
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations256
- ECCN CodeEAR99
- TechnologyCMOS
- Voltage - Supply5V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage5V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberDS21Q552
- JESD-30 CodeS-PBGA-B256
- FunctionTransceiver
- Qualification StatusNot Qualified
- Operating Temperature (Max)70°C
- Temperature GradeCOMMERCIAL
- InterfaceT1
- Number of Circuits4
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
DS21Q552 Overview
The package or case of the DS21Q552 transceiver is a 256-BGA, which stands for Ball Grid Array. This type of package is surface mountable, meaning it can be directly mounted onto the surface of a printed circuit board. The transceiver is also Pbfree, indicating that it is free from lead-based materials. The ECCN code for this device is EAR99, which means it does not require a specific export license. The peak reflow temperature for this transceiver is 260 degrees Celsius, ensuring that it can withstand high-temperature soldering processes. With a length and width of 27mm, this transceiver is compact and suitable for various applications.
DS21Q552 Features
Available in the 256-BGA package
DS21Q552 Applications
There are a lot of Maxim Integrated DS21Q552 Telecom applications.
T1 Rates PCM Line Interface
Channel Banks
Interfaces to E3
Routers
Wireless Local Loop
T1/E1/J1 add/drop multiplexers (MUX)
Channel Banks
Inverse Multiplexing for ATM (IMA) Wireless Base Stations
T1/E1/J1 Performance Monitoring
Central office
The package or case of the DS21Q552 transceiver is a 256-BGA, which stands for Ball Grid Array. This type of package is surface mountable, meaning it can be directly mounted onto the surface of a printed circuit board. The transceiver is also Pbfree, indicating that it is free from lead-based materials. The ECCN code for this device is EAR99, which means it does not require a specific export license. The peak reflow temperature for this transceiver is 260 degrees Celsius, ensuring that it can withstand high-temperature soldering processes. With a length and width of 27mm, this transceiver is compact and suitable for various applications.
DS21Q552 Features
Available in the 256-BGA package
DS21Q552 Applications
There are a lot of Maxim Integrated DS21Q552 Telecom applications.
T1 Rates PCM Line Interface
Channel Banks
Interfaces to E3
Routers
Wireless Local Loop
T1/E1/J1 add/drop multiplexers (MUX)
Channel Banks
Inverse Multiplexing for ATM (IMA) Wireless Base Stations
T1/E1/J1 Performance Monitoring
Central office
DS21Q552 More Descriptions
ROHS3Compliant Lead Free BOTTOM BALL Telecom IC Transceiver 70C 27mm 5V
Telecom Interface ICs 5V Quad T1 Transceiver
5V QUAD T1 XCVR 208 MCM BGA LF
Telecom Interface ICs 5V Quad T1 Transceiver
5V QUAD T1 XCVR 208 MCM BGA LF
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