Maxim Integrated DS21Q354
- Part Number:
- DS21Q354
- Manufacturer:
- Maxim Integrated
- Ventron No:
- 3180941-DS21Q354
- Description:
- IC TXRX T1/E1 QUAD 3.3V 256-BGA
- Datasheet:
- DS21Q354
Maxim Integrated DS21Q354 technical specifications, attributes, parameters and parts with similar specifications to Maxim Integrated DS21Q354.
- Factory Lead Time18 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-BGA
- Number of Pins256
- PackagingTray
- Published1998
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- ECCN CodeEAR99
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)240
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)20
- Base Part NumberDS21Q354
- FunctionTransceiver
- Qualification StatusNot Qualified
- Operating Temperature (Max)70°C
- Operating Supply Voltage3.3V
- Temperature GradeCOMMERCIAL
- InterfaceE1
- Number of Circuits4
- Length27mm
- Width27mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
DS21Q354 Overview
The packaging for this particular product is a tray, which was first published in 1998. The technology used in this product is CMOS, which stands for Complementary Metal-Oxide-Semiconductor. The terminal position for this packaging is located at the bottom, while the terminal form is in the shape of a ball. The maximum reflow temperature for this product is 20 seconds. The interface for this packaging is E1, and it contains a total of 4 circuits. The width of this packaging is 27mm. It is important to note that this product is not RoHS compliant, meaning that it does not meet the Restriction of Hazardous Substances directive. Overall, this packaging provides a reliable and efficient way to store and transport the product.
DS21Q354 Features
Available in the 256-BGA package
Operating supply voltage of 3.3V
DS21Q354 Applications
There are a lot of Maxim Integrated DS21Q354 Telecom applications.
Private branch exchange (PBX)
Interfaces to DS3
SONET/SDH terminal
CSU/DSU E1 Interface
PBXs channel bank
Inverse Multiplexing for ATM (IMA) Wireless Base Stations
E1 Network Equipment
Digital Access Cross-connect System (DACs)
T2 Rates PCM Line Interface
T3 channelized access concentrators
The packaging for this particular product is a tray, which was first published in 1998. The technology used in this product is CMOS, which stands for Complementary Metal-Oxide-Semiconductor. The terminal position for this packaging is located at the bottom, while the terminal form is in the shape of a ball. The maximum reflow temperature for this product is 20 seconds. The interface for this packaging is E1, and it contains a total of 4 circuits. The width of this packaging is 27mm. It is important to note that this product is not RoHS compliant, meaning that it does not meet the Restriction of Hazardous Substances directive. Overall, this packaging provides a reliable and efficient way to store and transport the product.
DS21Q354 Features
Available in the 256-BGA package
Operating supply voltage of 3.3V
DS21Q354 Applications
There are a lot of Maxim Integrated DS21Q354 Telecom applications.
Private branch exchange (PBX)
Interfaces to DS3
SONET/SDH terminal
CSU/DSU E1 Interface
PBXs channel bank
Inverse Multiplexing for ATM (IMA) Wireless Base Stations
E1 Network Equipment
Digital Access Cross-connect System (DACs)
T2 Rates PCM Line Interface
T3 channelized access concentrators
DS21Q354 More Descriptions
EAR99 E1 DS21Q354 Tray interface telecom 3.3V 27mm 70C
Telecom Interface ICs 3.3/5V Quad T1/E1 Transceiver
IC TXRX T1/E1 QUAD 3.3V 256-BGA
Telecom Interface ICs 3.3/5V Quad T1/E1 Transceiver
IC TXRX T1/E1 QUAD 3.3V 256-BGA
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