Cypress Semiconductor Corp CYV15G0402DXB-BGC

Name: CYV15G0402DXB-BGC
Brand: Cypress Semiconductor Corp
SKU: 3685551-CYV15G0402DXB-BGC
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: CYV15G0402DXB-BGC

Manufacturer:: Cypress Semiconductor Corp

Ventron No:: 3685551-CYV15G0402DXB-BGC

Description:: IC SERDES HOTLINK II 256LBGA

ECAD Model:

Datasheet:: CY(P,V)15G0402DXB

Specifications

Cypress Semiconductor Corp CYV15G0402DXB-BGC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CYV15G0402DXB-BGC.

Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
256-LBGA Exposed Pad
Number of Pins
256
Operating Temperature
0°C~70°C
Packaging
Tray
Published
2005
Series
HOTlink II™
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
5 (48 Hours)
Number of Terminations
256
Terminal Finish
Tin/Lead (Sn/Pb)
Subcategory
Network Interfaces
Technology
BICMOS
Voltage - Supply
3.135V~3.465V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
225
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
1.27mm
Reach Compliance Code
not_compliant
Reflow Temperature-Max (s)
30
Base Part Number
CY*15G04
Pin Count
256
Qualification Status
Not Qualified
Operating Supply Voltage
3.3V
Interface
LVTTL
Number of Circuits
4
Nominal Supply Current
1.06A
Current - Supply
830mA
Data Rate
1.5 Gbps
Telecom IC Type
TELECOM CIRCUIT
Number of Transceivers
4
Length
27mm
Width
27mm
RoHS Status
Non-RoHS Compliant

Description

CYV15G0402DXB-BGC Overview
The HOTlink II™ series offers a high-performance solution with 256 pins and a 3.3V supply voltage. The product is packaged in trays for easy handling and storage. The terminal finish is made of Tin/Lead (Sn/Pb) for reliable connectivity. With a peak reflow temperature of 225°C, this product is designed to withstand high-temperature environments. It is not compliant with Reach regulations, but it does meet the 3.3V operating supply voltage requirement. Please note that this product is currently non-RoHS compliant. With its BALL terminal form and superior specifications, the HOTlink II™ series is a top choice for your electronic needs.

CYV15G0402DXB-BGC Features
Available in the 256-LBGA Exposed Pad package
TELECOM CIRCUIT as telecom IC type
Operating supply voltage of 3.3V
4 transceivers

CYV15G0402DXB-BGC Applications
There are a lot of Cypress Semiconductor Corp CYV15G0402DXB-BGC Telecom applications.

Integrated Multi-Service Access Platforms (IMAPs)
Network Multiplexing and Terminating Equipment
Channel Banks
Remote wireless modules
T1/E1/J1 Multiplexer and Channel Banks
Inverse Multiplexing for ATM (IMA)
High-Density T1/E1/J1 interfaces for Multiplexers
Private branch exchange (PBX)
CSU/DSU E1/T1/J1 Interface
Voice over packet gateways

CYV15G0402DXB-BGC More Descriptions

IC TELECOM INTERFACE 256BGA
Telecom Circuit, 1-Func, BICMOS, PBGA256
IC SERDES HOTLINK II 256LBGA
OEMs, CMs ONLY (NO BROKERS)

Product Comparison

The three parts on the right have similar specifications to CYV15G0402DXB-BGC.

Image

Part Number

Manufacturer

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reach Compliance Code

Reflow Temperature-Max (s)

Base Part Number

Pin Count

Qualification Status

Operating Supply Voltage

Interface

Number of Circuits

Nominal Supply Current

Current - Supply

Data Rate

Telecom IC Type

Number of Transceivers

Length

Width

RoHS Status

Function

Number of Channels

Surface Mount

Pbfree Code

JESD-30 Code

Height Seated (Max)

View Compare
CYV15G0402DXB-BGC

Cypress Semiconductor Corp

Surface Mount

Surface Mount

256-LBGA Exposed Pad

256

0°C~70°C

Tray

2005

HOTlink II™

e0

Obsolete

5 (48 Hours)

256

Tin/Lead (Sn/Pb)

Network Interfaces

BICMOS

3.135V~3.465V

BOTTOM

BALL

225

1

3.3V

1.27mm

not_compliant

30

CY*15G04

256

Not Qualified

3.3V

LVTTL

4

1.06A

830mA

1.5 Gbps

TELECOM CIRCUIT

4

27mm

27mm

Non-RoHS Compliant

-

-

-

-

-

-

-
CYV15G0101DXB-BBC

Cypress Semiconductor Corp

Surface Mount

Surface Mount

100-LBGA

100

0°C~70°C

Tray

2005

HOTlink II™

e0

Obsolete

3 (168 Hours)

100

Tin/Lead (Sn/Pb)

Network Interfaces

BICMOS

3.135V~3.465V

BOTTOM

BALL

225

-

3.3V

-

not_compliant

NOT SPECIFIED

CY*15G01

-

Not Qualified

3.3V

LVTTL

-

500mA

390mA

-

TELECOM CIRCUIT

1

-

-

Non-RoHS Compliant

Transceiver

1

-

-

-

-

CYV15G0402DXB-BGC vs CYV15G0101DXB-BBC
CYV15G0201DXB-BBC

Cypress Semiconductor Corp

-

Surface Mount

196-LBGA

-

0°C~70°C

Tray

-

HOTlink II™

e0

Obsolete

3 (168 Hours)

196

TIN LEAD

-

BICMOS

3.135V~3.465V

BOTTOM

BALL

220

-

3.3V

1mm

unknown

NOT SPECIFIED

-

-

COMMERCIAL

-

LVTTL

2

-

570mA

-

TELECOM CIRCUIT

-

15mm

15mm

Non-RoHS Compliant

Transceiver

-

YES

no

S-PBGA-B196

1.5mm

CYV15G0402DXB-BGC vs CYV15G0201DXB-BBC
CYV15G0402DXB-BGXC

Cypress Semiconductor Corp

-

Surface Mount

256-LBGA Exposed Pad

-

0°C~70°C

Tray

-

HOTlink II™

e1

Obsolete

3 (168 Hours)

256

TIN SILVER COPPER

-

BICMOS

3.135V~3.465V

BOTTOM

BALL

260

1

3.3V

1.27mm

unknown

20

-

256

COMMERCIAL

-

LVTTL

4

-

830mA

-

TELECOM CIRCUIT

-

27mm

27mm

ROHS3 Compliant

-

-

YES

yes

S-PBGA-B256

-

CYV15G0402DXB-BGC vs CYV15G0402DXB-BGXC