CYP15G0101DXB-BBXC

Cypress Semiconductor Corp CYP15G0101DXB-BBXC

Part Number:
CYP15G0101DXB-BBXC
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
3685563-CYP15G0101DXB-BBXC
Description:
IC TXRX HOTLINK 100-LBGA
ECAD Model:
Datasheet:
CYP15G0101DXB-BBXC

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Specifications
Cypress Semiconductor Corp CYP15G0101DXB-BBXC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CYP15G0101DXB-BBXC.
  • Factory Lead Time
    15 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    100-LBGA
  • Number of Pins
    100
  • Operating Temperature
    0°C~70°C
  • Packaging
    Tray
  • Published
    2004
  • Series
    HOTlink II™
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    100
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Subcategory
    Network Interfaces
  • Max Power Dissipation
    1.25W
  • Technology
    BICMOS
  • Voltage - Supply
    3.135V~3.465V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    CY*15G01
  • Function
    Transceiver
  • Operating Supply Voltage
    3.3V
  • Number of Channels
    1
  • Interface
    LVTTL
  • Operating Supply Current
    500mA
  • Nominal Supply Current
    500mA
  • Max Supply Current
    500mA
  • Max Frequency
    150MHz
  • Telecom IC Type
    INTERFACE CIRCUIT
  • Number of Transceivers
    1
  • Height
    890μm
  • Length
    11mm
  • Width
    11mm
  • Radiation Hardening
    No
  • REACH SVHC
    No SVHC
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
CYP15G0101DXB-BBXC Overview
In order to save space on the board, 100-LBGA packages are used.To pack telecommunications equipment, the way of Tray is used.A Surface Mount-mount is used for mounting the telecom circuit.When the voltage for 3.135V~3.465V is provided, improved efficiency can be achieved.Telecom switching is possible to achieve reliable performance when the operating temperature is set at 0°C~70°C.A Surface Mount-axis mount is used.Configuration of the telecom circuit shows 100 terminations.It requires a supply voltage of 3.3V.The telecom interface has 100 pins.CY*15G01 can be used to locate related parts based on telecom switching's base part number.Telecom ICs are of type INTERFACE CIRCUIT.In order to provide designers with a great deal of flexibility, this telecom circuit operates on the supply voltage of 3.3V.Designers benefit from great flexibility since it works with the 500mA supply current.Network Interfaces includes telecommunications device as a subcategory.A number of similar functions of the telecommunication product can be provided by it as with those of electronic parts under the HOTlink II? series.When the supply current is at 500mA, the telecom IC will operate normally.Integrated wtelecommunication toolsh 1 transceivers, telecommunication tools provides wireless communication.In order to achieve its superior flexibility, 1 channels are used.

CYP15G0101DXB-BBXC Features
Available in the 100-LBGA package
INTERFACE CIRCUIT as telecom IC type
Operating supply voltage of 3.3V
Operating supply current of 500mA
1 transceivers

CYP15G0101DXB-BBXC Applications
There are a lot of Cypress Semiconductor Corp CYP15G0101DXB-BBXC Telecom applications.

DECT (Digital European Cordless Telephone) Base Stations
LAN Routers
M13 MUX
Fiber In The Loop (FITL)
T1/E1/J1 Performance Monitoring
T1 Rates PCM Line Interface
DSLAMs
T3 channelized access concentrators
Cable modem
Wireless base stations
CYP15G0101DXB-BBXC More Descriptions
Portfolio of Backplane Physical Layer (PHY) Devices, with max.speed 1500Mbps, BGA-100, RoHSCypress Semiconductor SCT
PHY 1-CH 195Mbps/1.5Gbps 3.3V 100-Pin TBGA Tray / IC TXRX HOTLINK 100-LBGA
IC, TRANSCEIVER, SINGLE, 3.3V, PBGA-100;; IC, TRANSCEIVER, SINGLE, 3.3V, PBGA-100; IC Interface Type:Parallel, Serial; Interface Applications:-; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V; Interface Case Style:BGA; No. of Pins:100; Operating Temperature Min:0°C
Product Comparison
The three parts on the right have similar specifications to CYP15G0101DXB-BBXC.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Subcategory
    Max Power Dissipation
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    Base Part Number
    Function
    Operating Supply Voltage
    Number of Channels
    Interface
    Operating Supply Current
    Nominal Supply Current
    Max Supply Current
    Max Frequency
    Telecom IC Type
    Number of Transceivers
    Height
    Length
    Width
    Radiation Hardening
    REACH SVHC
    RoHS Status
    Lead Free
    Terminal Pitch
    Reach Compliance Code
    Qualification Status
    Number of Circuits
    Current - Supply
    Supplier Device Package
    View Compare
  • CYP15G0101DXB-BBXC
    CYP15G0101DXB-BBXC
    15 Weeks
    Surface Mount
    Surface Mount
    100-LBGA
    100
    0°C~70°C
    Tray
    2004
    HOTlink II™
    e1
    yes
    Active
    3 (168 Hours)
    100
    Tin/Silver/Copper (Sn/Ag/Cu)
    Network Interfaces
    1.25W
    BICMOS
    3.135V~3.465V
    BOTTOM
    BALL
    260
    3.3V
    30
    CY*15G01
    Transceiver
    3.3V
    1
    LVTTL
    500mA
    500mA
    500mA
    150MHz
    INTERFACE CIRCUIT
    1
    890μm
    11mm
    11mm
    No
    No SVHC
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
  • CYP15G0401RB-BGI
    -
    Surface Mount
    Surface Mount
    256-LBGA Exposed Pad
    256
    -40°C~85°C
    Tray
    2005
    HOTlink II™
    e0
    -
    Obsolete
    3 (168 Hours)
    256
    Tin/Lead (Sn/Pb)
    -
    -
    BICMOS
    3.135V~3.465V
    BOTTOM
    BALL
    225
    3.3V
    30
    CY*15G04
    Receiver
    -
    -
    LVTTL
    -
    740mA
    -
    -
    TELECOM CIRCUIT
    -
    -
    27mm
    27mm
    -
    -
    Non-RoHS Compliant
    -
    1.27mm
    not_compliant
    Not Qualified
    4
    640mA
    -
  • CYP15G0101DXB-BBI
    -
    Surface Mount
    Surface Mount
    100-LBGA
    100
    -40°C~85°C
    Tray
    2005
    HOTlink II™
    e0
    -
    Obsolete
    3 (168 Hours)
    100
    Tin/Lead (Sn/Pb)
    Network Interfaces
    -
    BICMOS
    3.135V~3.465V
    BOTTOM
    BALL
    225
    3.3V
    -
    CY*15G01
    Transceiver
    3.3V
    1
    LVTTL
    -
    510mA
    -
    -
    INTERFACE CIRCUIT
    1
    -
    -
    -
    No
    -
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    390mA
    -
  • CYP15G0403DXB-BGC
    -
    -
    Surface Mount
    256-LBGA Exposed Pad
    -
    0°C~70°C
    Tray
    -
    HOTlink II™
    -
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    3.135V~3.465V
    -
    -
    -
    -
    -
    -
    Transceiver
    -
    -
    LVTTL
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    -
    -
    -
    4
    900mA
    256-BGA (27x27)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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