Rohm Semiconductor BU1851GUW-E2

BU1851GUW-E2 Overview
The mounting type for this particular electronic component is surface mount, meaning it is designed to be attached directly onto the surface of a circuit board. The package or case of the component is a 35-VFBGA, WLCSP, which refers to the type of casing that houses the internal components. The packaging for this component is cut tape (CT), which is a common way of shipping and storing small electronic parts. The moisture sensitivity level (MSL) for this component is 3 (168 hours), indicating that it can withstand moderate levels of moisture for up to 168 hours. It has 35 terminations, or points of connection, and a terminal pitch of 0.5mm. The power supply for this component is 3.3V and it is a single supply type. The maximum seated height for this component is 0.9mm.

BU1851GUW-E2 Features
Supplied in the 35-VFBGA, WLCSP package
Adopting a supply type of Single
Power supplies of 3.3V

BU1851GUW-E2 Applications
There are a lot of ROHM Semiconductor BU1851GUW-E2 Signal Switches / Multiplexers / Decoders applications.

Encrypted communications system
Speed synchronization of multiple motors in industries
Microprocessor instruction decoding
CPU memory location identification
HD surveillance system
Steel plants
RF-based home automation system
A robotic vehicle with the metal detector
Night vision cameras
Automatic Monitoring systems