Infineon Technologies BSP452 E6327
- Part Number:
- BSP452 E6327
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 3743420-BSP452 E6327
- Description:
- IC HIGH SIDE SWITCH SOT-223
- Datasheet:
- BSP452 E6327
Infineon Technologies BSP452 E6327 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies BSP452 E6327.
- Mounting TypeSurface Mount
- Package / CaseTO-261-4, TO-261AA
- Surface MountYES
- Operating Temperature-40°C~150°C TJ
- PackagingTape & Reel (TR)
- Published2007
- SeriesminiPROFET®
- JESD-609 Codee3
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations4
- ECCN CodeEAR99
- Terminal FinishMatte Tin (Sn)
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage13.5V
- Terminal Pitch2.3mm
- Reflow Temperature-Max (s)40
- Base Part NumberBSP452
- Pin Count4
- JESD-30 CodeR-PDSO-G4
- Number of Outputs1
- Qualification StatusNot Qualified
- Output TypeN-Channel
- Supply Voltage-Max (Vsup)34V
- Supply Voltage-Min (Vsup)5V
- InterfaceOn/Off
- Current - Output (Max)700mA
- Output ConfigurationHigh Side
- Voltage - Supply (Vcc/Vdd)Not Required
- Input TypeNon-Inverting
- Switch TypeGeneral Purpose
- Ratio - Input:Output1:1
- Voltage - Load5V~34V
- Fault ProtectionCurrent Limiting (Fixed), Over Temperature, Over Voltage
- Output Peak Current Limit-Nom1.7A
- Rds On (Typ)160m Ω
- Built-in ProtectionsTRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
- Output Current Flow DirectionSINK
- Length6.5mm
- Width3.5mm
- RoHS StatusNon-RoHS Compliant
BSP452 E6327 Overview
Infineon Technologies offers a highly efficient PMIC - Power Distribution Switches, Load Drivers chip, specifically designed for the PMIC - Power Distribution Switches, Load Drivers category. This chip, known as the miniPROFET® BSP452, is surface mountable and comes in Tape & Reel (TR) packaging. It features a 1:1 input to output ratio and has a terminal pitch of 2.3mm. Additionally, it is Pbfree and has a matte tin (Sn) terminal finish. Please note that the RoHS status for this chip is currently Non-RoHS Compliant.
BSP452 E6327 Features
Supplied from 13.5V
BSP452 E6327 Applications
There are a lot of Infineon Technologies BSP452 E6327 Power Switches ICs applications.
Hot-Swap Systems
Gaming
Set-Top Boxes
Portable Devices
Portable Video Game Players
Solid State Drivers
Notebook PC
Smartphone and PDA
USB3.1 Power Delivery
Hot Swaps
Infineon Technologies offers a highly efficient PMIC - Power Distribution Switches, Load Drivers chip, specifically designed for the PMIC - Power Distribution Switches, Load Drivers category. This chip, known as the miniPROFET® BSP452, is surface mountable and comes in Tape & Reel (TR) packaging. It features a 1:1 input to output ratio and has a terminal pitch of 2.3mm. Additionally, it is Pbfree and has a matte tin (Sn) terminal finish. Please note that the RoHS status for this chip is currently Non-RoHS Compliant.
BSP452 E6327 Features
Supplied from 13.5V
BSP452 E6327 Applications
There are a lot of Infineon Technologies BSP452 E6327 Power Switches ICs applications.
Hot-Swap Systems
Gaming
Set-Top Boxes
Portable Devices
Portable Video Game Players
Solid State Drivers
Notebook PC
Smartphone and PDA
USB3.1 Power Delivery
Hot Swaps
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