APA600-FG256

Microsemi Corporation APA600-FG256

Part Number:
APA600-FG256
Manufacturer:
Microsemi Corporation
Ventron No:
3821779-APA600-FG256
Description:
IC FPGA 186 I/O 256FBGA
ECAD Model:
Datasheet:
APA600-FG256

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Microsemi Corporation APA600-FG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation APA600-FG256.
  • Factory Lead Time
    18 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Weight
    400.011771mg
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Tray
  • Published
    2009
  • Series
    ProASICPLUS
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    3A001.A.7.A
  • Terminal Finish
    TIN LEAD/TIN LEAD SILVER
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    2.3V~2.7V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1mm
  • Frequency
    180MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    APA600
  • Number of Outputs
    186
  • Operating Supply Voltage
    2.5V
  • Power Supplies
    2.52.5/3.3V
  • Number of I/O
    186
  • RAM Size
    15.8kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    129024
  • Number of Gates
    600000
  • Number of Registers
    21504
  • Height
    1.2mm
  • Length
    17mm
  • Width
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
Description
APA600-FG256 Overview
This component is manufactured by Microsemi Corporation and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It has a weight of 400.011771mg and an operating temperature range of 0°C to 70°C. The packaging for this part is in a tray and it is currently in active production. Its Moisture Sensitivity Level (MSL) is rated at level 3, meaning it can withstand exposure to moisture for up to 168 hours. The ECCN Code for this component is 3A001.A.7.A, indicating its export control classification. It has a total of 186 input/output connections and a total of 129024 bits of Random Access Memory (RAM). The length and width of this component are both 17mm.

APA600-FG256 Features
186 I/Os
Up to 129024 RAM bits
256 LABs/CLBs
21504 registers
Operating from a frequency of 180MHz

APA600-FG256 Applications
There are a lot of Microsemi Corporation APA600-FG256 FPGAs applications.

Device controllers
Military Temperature
Industrial IoT
Camera time adjustments
Data center hardware accelerators
Medical imaging
Consumer Electronics
Integrating multiple SPLDs
Computer hardware emulation
Software-defined radio
APA600-FG256 More Descriptions
FPGA ProASICPLUS Family 600K Gates 180MHz 0.22um (CMOS) Technology 2.5V 256-Pin FBGA
Apa600-Fg256 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip APA600-FG256
ProASICPlus FPGA, 600K System Gates
IC FPGA PROASIC 600K 256-FBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.