Microsemi Corporation AFS250-1QNG180
- Part Number:
- AFS250-1QNG180
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3639809-AFS250-1QNG180
- Description:
- IC FPGA 65 I/O 180QFN
- ECAD Model:
-
- Datasheet:
- Fusion Family Mixed Signal FPGAs
Microsemi Corporation AFS250-1QNG180 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation AFS250-1QNG180.
- Mounting TypeSurface Mount
- Package / Case180-WFQFN Dual Rows, Exposed Pad
- Supplier Device Package180-QFN (10x10)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- SeriesFusion®
- Published2013
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Voltage - Supply1.425V~1.575V
- Base Part NumberAFS250
- Number of I/O65
- Total RAM Bits36864
- Number of Gates250000
AFS250-1QNG180 Overview
Fpga chips is supplied in the 180-WFQFN Dual Rows, Exposed Pad package. Fpga chips is programmed wFpga chipsh 65 I/Os for transferring data in a more coherent manner. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.425V~1.575V. It is a type of FPGA belonging to the Fusion® seies. The operating temperature should be kept at 0°C~85°C TJ when operating. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 36864. Its base part number AFS250 can be used to find related parts. Its basic building block contains 250000 gates. It employs 180-QFN (10x10) as its supplier device package.
AFS250-1QNG180 Features
65 I/Os
Up to 36864 RAM bits
AFS250-1QNG180 Applications
There are a lot of Microsemi Corporation
AFS250-1QNG180 FPGAs applications.
Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Fpga chips is supplied in the 180-WFQFN Dual Rows, Exposed Pad package. Fpga chips is programmed wFpga chipsh 65 I/Os for transferring data in a more coherent manner. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.425V~1.575V. It is a type of FPGA belonging to the Fusion® seies. The operating temperature should be kept at 0°C~85°C TJ when operating. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 36864. Its base part number AFS250 can be used to find related parts. Its basic building block contains 250000 gates. It employs 180-QFN (10x10) as its supplier device package.
AFS250-1QNG180 Features
65 I/Os
Up to 36864 RAM bits
AFS250-1QNG180 Applications
There are a lot of Microsemi Corporation
AFS250-1QNG180 FPGAs applications.
Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
AFS250-1QNG180 More Descriptions
FPGA Fusion® Family 250K Gates 1282.05MHz 130nm (CMOS) Technology 1.5V 180-Pin QFN EP
IC FPGA 2MB FLASH 250K 180-QFN
IC FPGA 65 I/O 180QFN
IC FPGA 2MB FLASH 250K 180-QFN
IC FPGA 65 I/O 180QFN
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