AFS090-1FG256I

Microsemi Corporation AFS090-1FG256I

Part Number:
AFS090-1FG256I
Manufacturer:
Microsemi Corporation
Ventron No:
3127702-AFS090-1FG256I
Description:
IC FPGA 75 I/O 256FBGA
ECAD Model:
Datasheet:
Fusion Family Mixed Signal FPGAs

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Specifications
Microsemi Corporation AFS090-1FG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation AFS090-1FG256I.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Weight
    400.011771mg
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    Fusion®
  • Published
    2013
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • Terminal Finish
    TIN LEAD/TIN LEAD SILVER
  • Technology
    CMOS
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    1.5V
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    AFS090
  • Operating Supply Voltage
    1.5V
  • Number of I/O
    75
  • RAM Size
    3.4kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    27648
  • Number of Gates
    90000
  • Max Frequency
    1.28205GHz
  • Speed Grade
    1
  • Number of Registers
    2304
  • Height
    1.2mm
  • Length
    17mm
  • Width
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
Description
AFS090-1FG256I Overview
A 256-LBGA package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 75 I/Os help it transfer data more efficiently. Power is provided by a 1.5V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 1.425V~1.575V and uses a battery to supply power. FPGAs belonging to the Fusion® series are a type of FPGA that belong to the Fusion® series of FPGAs. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. A model of this FPGA is contained in Tray for the purpose of saving space. In total, there are a total of 256 terminations on fpga chips. Having a RAM bit size of 27648 means that this device will offer you a lot of memory. For related parts, use its base part number AFS090. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. This cable has 256 pins and is designed to connect to a computer. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. With a 1.5V supply voltage, designers can fully utilize the flexibility of the device. 90000 gates make up the basic block of its construction. The registers used in the transfer of and storage of data are 2304 in number. A FPGA of this type can achieve a speed as high as 1.28205GHz.

AFS090-1FG256I Features
75 I/Os
Up to 27648 RAM bits
256 LABs/CLBs
2304 registers


AFS090-1FG256I Applications
There are a lot of Microsemi Corporation
AFS090-1FG256I FPGAs applications.


Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
Distributed Monetary Systems
AFS090-1FG256I More Descriptions
FPGA Fusion Family 90K Gates 1282.05MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
IC FPGA 2MB FLASH 90K 256FBGA
IC FPGA 75 I/O 256FBGA
IC FPGA 81 I/O 100VQFP
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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