AFS090-1FG256

Microsemi Corporation AFS090-1FG256

Part Number:
AFS090-1FG256
Manufacturer:
Microsemi Corporation
Ventron No:
3126547-AFS090-1FG256
Description:
IC FPGA 75 I/O 256FBGA
ECAD Model:
Datasheet:
Fusion Family Mixed Signal FPGAs

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Specifications
Microsemi Corporation AFS090-1FG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation AFS090-1FG256.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Supplier Device Package
    256-FPBGA (17x17)
  • Weight
    400.011771mg
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Series
    Fusion®
  • Published
    2013
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    70°C
  • Min Operating Temperature
    0°C
  • Voltage - Supply
    1.425V~1.575V
  • Base Part Number
    AFS090
  • Operating Supply Voltage
    1.5V
  • Max Supply Voltage
    1.575V
  • Min Supply Voltage
    1.425V
  • Number of I/O
    75
  • RAM Size
    3.4kB
  • Total RAM Bits
    27648
  • Number of Gates
    90000
  • Max Frequency
    1.28205GHz
  • Speed Grade
    1
  • Number of Registers
    2304
  • Height
    1.2mm
  • Length
    17mm
  • Width
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
Description
AFS090-1FG256 Overview
In the package 256-LBGA, this product is provided. A total of 75 I/Os are programmed to ensure a more coherent data transfer. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.425V~1.575V, this device operates with ease. This is a type of FPGA that is part of the Fusion® series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 27648 bfpga electronics s of RAM. AFS090 is the base part number that can be used to identify related parts. The RAM si3.4kBe of this FPGA module reaches 3.4kB so as to guarantee the normal operation of the program during operation. The device has 256 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.5V, designers can take advantage of its flexibility to the fullest extent. This module can reach a maximum operating temperature of 70°C when operating at its maximum power. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. A basic building block for this type of building block consists of 90000 gates. The structure of the registers used to store and transfer data consists of 2304 registers. The maximum supply voltage it can take is 1.575V. The device can function at a minimum voltage of 1.425V. In fact, this FPGA is capable of reaching a speed of 1.28205GHz. As a supplier, 256-FPBGA (17x17) is responsible for the package of its devices.

AFS090-1FG256 Features
75 I/Os
Up to 27648 RAM bits
256 LABs/CLBs
70°C gates
2304 registers


AFS090-1FG256 Applications
There are a lot of Microsemi Corporation
AFS090-1FG256 FPGAs applications.


Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
Distributed Monetary Systems
Data Center
AFS090-1FG256 More Descriptions
FPGA Fusion Family 90K Gates 1282.05MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
IC FPGA 75 I/O 256FBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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