Analog Devices Inc. ADSP-2186MKCA-300
- Part Number:
- ADSP-2186MKCA-300
- Manufacturer:
- Analog Devices Inc.
- Ventron No:
- 3125363-ADSP-2186MKCA-300
- Description:
- IC DSP CONTROLLER 16BIT 144MBGA
- Datasheet:
- ADSP-2186MKCA-300
Analog Devices Inc. ADSP-2186MKCA-300 technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. ADSP-2186MKCA-300.
- Mounting TypeSurface Mount
- Package / Case144-LFBGA
- Surface MountYES
- Operating Temperature0°C~70°C TA
- PackagingTray
- SeriesADSP-21xx
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations144
- Terminal FinishTIN LEAD SILVER
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)240
- Supply Voltage2.5V
- Terminal Pitch0.8mm
- Reach Compliance Codeunknown
- Reflow Temperature-Max (s)30
- Pin Count144
- JESD-30 CodeS-PBGA-B144
- Qualification StatusCOMMERCIAL
- Supply Voltage-Max (Vsup)2.63V
- Supply Voltage-Min (Vsup)2.37V
- InterfaceHost Interface, Serial Port
- Clock Frequency37.5MHz
- Address Bus Width14
- Boundary ScanNO
- Low Power ModeYES
- External Data Bus Width24
- Voltage - I/O3.30V
- Barrel ShifterYES
- Internal Bus ArchitectureMULTIPLE
- Non-Volatile MemoryExternal
- Voltage - Core2.50V
- On Chip Data RAM40kB
- Clock Rate75MHz
- Height Seated (Max)1.4mm
- Length10mm
- Width10mm
- RoHS StatusNon-RoHS Compliant
ADSP-2186MKCA-300 Overview
The package or case for this particular product is a 144-LFBGA, which stands for low profile fine-pitch ball grid array. It is a type of integrated circuit package that is commonly used for high-density and high-performance applications. The packaging for this product is a tray, which is a convenient and efficient way to store and transport multiple units. The terminal finish for this package is TIN LEAD SILVER, which is a common type of plating used to protect the terminals from corrosion. The terminal position is located on the bottom of the package, making it easy to connect to other components. The supply voltage for this product is 2.5V, with a minimum supply voltage of 2.37V. The terminal pitch, or distance between each terminal, is 0.8mm. This product does not have boundary scan capabilities. The voltage for input/output is 3.30V, while the non-volatile memory is external, meaning it is not built into the package itself.
ADSP-2186MKCA-300 Features
Supplied in the 144-LFBGA package
ADSP-2186MKCA-300 Applications
There are a lot of Rochester Electronics, LLC ADSP-2186MKCA-300 DSP applications.
Control systems
TVs
Remote sensing image processing technology
Electronic information engineering
Telephone conversations
Financial signals
3D tomography and imaging processing
Infinite impulse response filters
Automatic analysis system of EEG or ECG
Real-time effects
The package or case for this particular product is a 144-LFBGA, which stands for low profile fine-pitch ball grid array. It is a type of integrated circuit package that is commonly used for high-density and high-performance applications. The packaging for this product is a tray, which is a convenient and efficient way to store and transport multiple units. The terminal finish for this package is TIN LEAD SILVER, which is a common type of plating used to protect the terminals from corrosion. The terminal position is located on the bottom of the package, making it easy to connect to other components. The supply voltage for this product is 2.5V, with a minimum supply voltage of 2.37V. The terminal pitch, or distance between each terminal, is 0.8mm. This product does not have boundary scan capabilities. The voltage for input/output is 3.30V, while the non-volatile memory is external, meaning it is not built into the package itself.
ADSP-2186MKCA-300 Features
Supplied in the 144-LFBGA package
ADSP-2186MKCA-300 Applications
There are a lot of Rochester Electronics, LLC ADSP-2186MKCA-300 DSP applications.
Control systems
TVs
Remote sensing image processing technology
Electronic information engineering
Telephone conversations
Financial signals
3D tomography and imaging processing
Infinite impulse response filters
Automatic analysis system of EEG or ECG
Real-time effects
ADSP-2186MKCA-300 More Descriptions
Digital Signal Processor, 16-Bit Size, 24-Ext Bit, 20MHz, CMOS, PQFP128
8K/8K 16 BIT DSP 75MHZ 2.5V MINI BGA
IC DSP CONTROLLER 16BIT 144MBGA
16-BIT DIGITAL SIGNAL PROCESSOR
The ADSP-2186M combines the ADSP-2100 family base architecture (three computational units, data address generators and a program sequencer) with two serial ports, a 16-bit internal DMA port, a byte DMA port, a programmable timer, Flag I/O, and extensive interrupt capabilities. BENEFITS Algebraic assembly language supports C language-style constructs for easy programming Mini-BGA and 100-lead T LQFP package provides for space and power savings (16mm x 16mm) On-chip RAM and 4 DMA ports make reprogramming easy 16-bit DMA port makes bus interfacing easier 5 sleep and powerdown modes maximize battery life.
8K/8K 16 BIT DSP 75MHZ 2.5V MINI BGA
IC DSP CONTROLLER 16BIT 144MBGA
16-BIT DIGITAL SIGNAL PROCESSOR
The ADSP-2186M combines the ADSP-2100 family base architecture (three computational units, data address generators and a program sequencer) with two serial ports, a 16-bit internal DMA port, a byte DMA port, a programmable timer, Flag I/O, and extensive interrupt capabilities. BENEFITS Algebraic assembly language supports C language-style constructs for easy programming Mini-BGA and 100-lead T LQFP package provides for space and power savings (16mm x 16mm) On-chip RAM and 4 DMA ports make reprogramming easy 16-bit DMA port makes bus interfacing easier 5 sleep and powerdown modes maximize battery life.
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