Infineon Technologies ADM7008XA3T1

ADM7008XA3T1 Overview
The package or case for this particular component is a 128-BFQFP, which stands for 128-pin, quad flat pack. This type of packaging is commonly used for integrated circuits and other electronic components. The packaging for this component is a tray, which is a shallow, flat container used for holding and transporting electronic components. This particular component was published in 2006, meaning it was first released to the public in that year. However, it is now considered obsolete, indicating that it is no longer being produced or supported by the manufacturer. The moisture sensitivity level (MSL) for this component is 1, which means it has an unlimited shelf life and can be stored in any environment. The voltage supply for this component is 3V to 3.6V, and the base part number is ADM7008.

ADM7008XA3T1 Features

ADM7008XA3T1 Applications
There are a lot of Infineon Technologies ADM7008XA3T1 Controllers Interface ICs applications.

Telecom, 5G LTE Base-Station
AV accessory
DSPs
Tablets, Netbooks, Ultra?Mobile PCs
Smart Cities
Docking Stations
Automotive Breakout Boxes
PLCs
Monitors
Medical Devices