A3P400-2FG256I

Microsemi Corporation A3P400-2FG256I

Part Number:
A3P400-2FG256I
Manufacturer:
Microsemi Corporation
Ventron No:
3126760-A3P400-2FG256I
Description:
IC FPGA 178 I/O 256FBGA
ECAD Model:
Datasheet:
A3P400-2FG256I

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Specifications
Microsemi Corporation A3P400-2FG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A3P400-2FG256I.
  • Factory Lead Time
    20 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Weight
    400.011771mg
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    ProASIC3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • Terminal Finish
    TIN LEAD/TIN LEAD SILVER
  • Technology
    CMOS
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    1.5V
  • Terminal Pitch
    1mm
  • Frequency
    310MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    A3P400
  • Operating Supply Voltage
    1.5V
  • Number of I/O
    178
  • RAM Size
    6.8kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    55296
  • Number of Gates
    400000
  • Speed Grade
    2
  • Number of Registers
    9216
  • Height
    1.2mm
  • Length
    17mm
  • Width
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
Description
A3P400-2FG256I Overview
The Microsemi Corporation brand offers a wide range of electronic components, including their Embedded - FPGAs (Field Programmable Gate Array) chips. This particular chip falls under the Embedded - FPGAs (Field Programmable Gate Array) category and has a current Lifecycle Status of IN PRODUCTION (Last Updated: 3 weeks ago). It is designed for Surface Mount mounting and has a 256-LBGA package/case. Additionally, the part is currently Active and utilizes CMOS technology with a voltage supply range of 1.425V~1.575V. The chip can withstand a peak reflow temperature of 225 degrees Celsius and has an operating supply voltage of 1.5V. With a Total RAM Bits of 55296 and 400000 gates, this Microsemi Corporation part offers high performance and reliability.

A3P400-2FG256I Features
178 I/Os
Up to 55296 RAM bits
256 LABs/CLBs
9216 registers
Operating from a frequency of 310MHz

A3P400-2FG256I Applications
There are a lot of Microsemi Corporation A3P400-2FG256I FPGAs applications.

Data center search engines
Broadcast
Security systems
Enterprise networking
Military DSP
Defense Applications
Image processing
Data center hardware accelerators
Medical imaging
ADAS
A3P400-2FG256I More Descriptions
FPGA ProASIC®3 Family 400K Gates 310MHz 130nm Technology 1.5V 256-Pin FBGA Tray
A3P400-2Fg256I 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip A3P400-2FG256I
FPGA - Field Programmable Gate Array A3P400-2FG256I
IC FPGA 1KB FLASH 400K 256-FBGA
ProASIC3 Flash FPGA 400K System Gates
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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