| Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product! |
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| Part Number: |
FCN3022A474K-X |
FCN3925E274K |
| Manufacturer: |
Cornell Dubilier Electronics (CDE) |
Cornell Dubilier Electronics (CDE) |
| Description: |
CAP FILM 0.47UF 10% 100VDC 3022 |
CAP FILM 0.27UF 10% 250VDC 3925 |
| Quantity Available: |
Available |
Available |
| Datasheets: |
-
|
-
|
| Factory Lead Time |
14 Weeks |
- |
| Mount |
Surface Mount |
Surface Mount |
| Mounting Type |
Surface Mount |
Surface Mount |
| Package / Case |
3022 (7755 Metric) |
3925 (9863 Metric) |
| Terminal Shape |
WRAPAROUND |
WRAPAROUND |
| Number of Pins |
2 |
- |
| Dielectric Material |
Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked |
Polyester, Polyethylene Naphthalate (PEN), Metallized - Stacked |
| Operating Temperature |
-40°C~85°C |
-40°C~85°C |
| Packaging |
Tape & Reel (TR) |
Bulk |
| Series |
FCN |
FCN |
| Published |
2013 |
2015 |
| Size / Dimension |
0.303Lx0.217W 7.70mmx5.50mm |
0.386Lx0.248W 9.80mmx6.30mm |
| Tolerance |
±10% |
±10% |
| JESD-609 Code |
e1 |
e1 |
| Pbfree Code |
yes |
yes |
| Part Status |
Active |
Obsolete |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
1 (Unlimited) |
| Number of Terminations |
2 |
2 |
| Termination |
Solder Pads |
Solder Pads |
| ECCN Code |
EAR99 |
EAR99 |
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Applications |
General Purpose |
General Purpose |
| Capacitance |
0.47μF |
0.27μF |
| Voltage - Rated DC |
100V |
250V |
| Packing Method |
TR, 13 INCH |
TR, 13 INCH |
| Reach Compliance Code |
unknown |
unknown |
| Voltage - Rated AC |
63V |
- |
| Case Code (Metric) |
7755 |
- |
| Case Code (Imperial) |
3022 |
- |
| Capacitor Type |
FILM CAPACITOR |
FILM CAPACITOR |
| Height |
4mm |
- |
| Height Seated (Max) |
0.165 4.19mm |
0.162 4.11mm |
| Length |
7.7mm |
9.8mm |
| Width |
5.5mm |
6.3mm |
| RoHS Status |
ROHS3 Compliant |
ROHS3 Compliant |
| HTS Code |
- |
8532.25.00.45 |
| Submit RFQ: |
Submit |
Submit |
