NXP USA Inc. 74LVCH16373ADGG:51

74LVCH16373ADGG:51 Overview
This particular component is produced by NXP USA Inc. and falls under the category of Logic - Latches. It is a chip specifically designed for latching functions. The packaging or casing for this part is a 48-TFSOP (0.240, 6.10mm Width), and it has an operating temperature range of -40°C to 125°C. It is currently listed as an obsolete part. The packing method for this component is TAPE AND REEL, which is a common method used for shipping and storing electronic components. The terminal pitch, or distance between each terminal, is 0.5mm. The maximum temperature for reflow, or the process of melting and re-solidifying solder joints, is 30 seconds. This chip has a 3-STATE output characteristic, meaning it can have three different output states: high, low, and high impedance. The current output for both high and low states is 24mA. The logic type for this chip is D-Type Transparent Latch, which refers to the type of logic gate used in its design. The delay time for propagation, or the time it takes for the output to change after a change in input, is 1.5ns.

74LVCH16373ADGG:51 Features
48-TFSOP (0.240, 6.10mm Width) package
74LVCH series
8 Bits
74LVCH16373 family
48 pin count
3.3V power supplies

74LVCH16373ADGG:51 Applications
There are a lot of NXP USA Inc. 74LVCH16373ADGG:51 Latches applications.

BCD counting
Parallel data storage
Address register
Pseudo-random code generators
Frequency
Motor Drives
Relay
Decade counting 7-segment decimal display
Watches
Parallel data synchronization