Altera 5CEFA2F23C8N

5CEFA2F23C8N Overview
The package or case for this particular item is a 484-BGA, which stands for ball grid array. This type of packaging is commonly used for electronic components, as it allows for a large number of connections in a small space. The packaging for this item is a tray, which is a flat, shallow container used to hold and transport electronic components. The part status for this item is active, meaning it is currently in production and available for purchase. The HTS code, which stands for Harmonized Tariff Schedule, for this item is 8542.39.00.01, indicating that it is an electronic integrated circuit. The terminal position is located at the bottom of the package, and the terminal pitch, or distance between terminals, is 1mm. The reflow temperature-max, which is the maximum temperature at which the component can be soldered, is not specified. The JESD-30 code for this item is S-PBGA-B484, indicating that it is a plastic ball grid array with 484 balls. This particular component is a field programmable gate array, meaning it can be programmed and reconfigured after manufacturing. Its length is 23mm, making it compact and suitable for a variety of electronic applications.

5CEFA2F23C8N Features
224 I/Os
Up to 2002944 RAM bits

5CEFA2F23C8N Applications
There are a lot of Intel 5CEFA2F23C8N FPGAs applications.

Development Boards and Shields for Microcontrollers
Electronic Warfare
Security systems
Scientific Instruments
Voice recognition
Automotive
Automation
Embedded Vision
Enterprise networking
Data Center