Part Number: TSI108-200CL vs TSI107D-133LEY

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Part Number: TSI108-200CL TSI107D-133LEY
Manufacturer: IDT, Integrated Device Technology Inc IDT, Integrated Device Technology Inc
Description: IC HOST BRIDGE POWERPC 1023BGA IC HOST BRIDGE POWERPC 503FCBGA
Quantity Available: Available Available
Datasheets: IDTTSI108 Product Brief -
Mount Surface Mount Surface Mount
Package / Case FCBGA FCBGA
Number of Pins 1023 503
Published 1999 1999
JESD-609 Code e0 e1
Pbfree Code no no
Part Status Discontinued Discontinued
Moisture Sensitivity Level (MSL) 4 3
ECCN Code 3A991.A.2 EAR99
Terminal Finish Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01 8542.39.00.01
Technology CMOS CMOS
Terminal Position BOTTOM BOTTOM
Terminal Form BALL BALL
Peak Reflow Temperature (Cel) 225 260
Supply Voltage 1.2V 2.5V
Terminal Pitch 1mm 1.27mm
Reach Compliance Code not_compliant -
Reflow Temperature-Max (s) NOT SPECIFIED -
Qualification Status Not Qualified -
Operating Temperature (Max) 70°C -
Supply Voltage-Max (Vsup) 1.26V 2.625V
Temperature Grade COMMERCIAL -
Supply Voltage-Min (Vsup) 1.14V 2.375V
Interface PCI PCI
Clock Frequency 33.33MHz 66MHz
Bus Compatibility POWERPC 60X -
Height Seated (Max) 2.76mm -
Length 33mm 33mm
Width 33mm 33mm
Thickness 2mm 2.75mm
RoHS Status Non-RoHS Compliant RoHS Compliant
Lead Free Contains Lead Contains Lead
Number of Terminations - 503
Max Operating Temperature - 105°C
Min Operating Temperature - 0°C
Pin Count - 503
Number of I/O - 64
Boundary Scan - YES
Radiation Hardening - No
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