Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product! |
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Part Number: |
XA6SLX9-2CSG324Q |
XA6SLX25-2CSG324I |
Manufacturer: |
Xilinx Inc. |
Xilinx Inc. |
Description: |
IC FPGA 200 I/O 324CSGBGA |
IC FPGA 226 I/O 324CSGBGA |
Quantity Available: |
Available |
Available |
Datasheets: |
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Factory Lead Time |
10 Weeks |
10 Weeks |
Mount |
Surface Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Surface Mount |
Package / Case |
324-LFBGA, CSPBGA |
324-LFBGA, CSPBGA |
Number of Pins |
324 |
324 |
Operating Temperature |
-40°C~125°C TJ |
-40°C~100°C TJ |
Series |
Automotive, AEC-Q100, Spartan®-6 LX XA |
Automotive, AEC-Q100, Spartan®-6 LX XA |
Published |
2008 |
2008 |
JESD-609 Code |
e1 |
e1 |
Part Status |
Active |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
3 (168 Hours) |
Number of Terminations |
324 |
324 |
ECCN Code |
3A991.D |
3A991.D |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Subcategory |
Field Programmable Gate Arrays |
Field Programmable Gate Arrays |
Voltage - Supply |
1.14V~1.26V |
1.14V~1.26V |
Terminal Position |
BOTTOM |
BOTTOM |
Terminal Form |
BALL |
BALL |
Peak Reflow Temperature (Cel) |
260 |
260 |
Terminal Pitch |
0.8mm |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
30 |
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Base Part Number |
XA6SLX9 |
XA6SLX25 |
Number of Outputs |
200 |
226 |
Qualification Status |
Not Qualified |
Not Qualified |
Operating Supply Voltage |
1.2V |
1.2V |
Number of I/O |
200 |
226 |
RAM Size |
72kB |
117kB |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
9152 |
24051 |
Total RAM Bits |
589824 |
958464 |
Number of LABs/CLBs |
715 |
1879 |
Speed Grade |
2 |
2 |
Number of Registers |
11440 |
30064 |
RoHS Status |
ROHS3 Compliant |
ROHS3 Compliant |
Packaging |
- |
Tray |
Reflow Temperature-Max (s) |
- |
30 |
Submit RFQ: |
Submit |
Submit |