| Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product! |
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| Part Number: |
XA6SLX9-2CSG324Q |
XA6SLX16-2FTG256Q |
| Manufacturer: |
Xilinx Inc. |
Xilinx Inc. |
| Description: |
IC FPGA 200 I/O 324CSGBGA |
IC FPGA 186 I/O 256FTGBGA |
| Quantity Available: |
Available |
Available |
| Datasheets: |
-
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-
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| Factory Lead Time |
10 Weeks |
10 Weeks |
| Mount |
Surface Mount |
Surface Mount |
| Mounting Type |
Surface Mount |
Surface Mount |
| Package / Case |
324-LFBGA, CSPBGA |
256-LBGA |
| Number of Pins |
324 |
256 |
| Operating Temperature |
-40°C~125°C TJ |
-40°C~125°C TJ |
| Series |
Automotive, AEC-Q100, Spartan®-6 LX XA |
Automotive, AEC-Q100, Spartan®-6 LX XA |
| Published |
2008 |
2008 |
| JESD-609 Code |
e1 |
e1 |
| Part Status |
Active |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
3 (168 Hours) |
| Number of Terminations |
324 |
256 |
| ECCN Code |
3A991.D |
- |
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Subcategory |
Field Programmable Gate Arrays |
Field Programmable Gate Arrays |
| Voltage - Supply |
1.14V~1.26V |
1.14V~1.26V |
| Terminal Position |
BOTTOM |
BOTTOM |
| Terminal Form |
BALL |
BALL |
| Peak Reflow Temperature (Cel) |
260 |
- |
| Terminal Pitch |
0.8mm |
1mm |
| Time@Peak Reflow Temperature-Max (s) |
30 |
- |
| Base Part Number |
XA6SLX9 |
XA6SLX16 |
| Number of Outputs |
200 |
186 |
| Qualification Status |
Not Qualified |
Not Qualified |
| Operating Supply Voltage |
1.2V |
1.2V |
| Number of I/O |
200 |
186 |
| RAM Size |
72kB |
72kB |
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells |
9152 |
14579 |
| Total RAM Bits |
589824 |
589824 |
| Number of LABs/CLBs |
715 |
1139 |
| Speed Grade |
2 |
2 |
| Number of Registers |
11440 |
18224 |
| RoHS Status |
ROHS3 Compliant |
ROHS3 Compliant |
| Packaging |
- |
Tray |
| Submit RFQ: |
Submit |
Submit |
