Part Number: XA6SLX16-3FTG256I vs XA6SLX25-2CSG324I

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Part Number: XA6SLX16-3FTG256I XA6SLX25-2CSG324I
Manufacturer: Xilinx Inc. Xilinx Inc.
Description: IC FPGA 186 I/O 256FTGBGA IC FPGA 226 I/O 324CSGBGA
Quantity Available: Available Available
Datasheets: - -
Mount Surface Mount Surface Mount
Package / Case TFBGA 324-LFBGA, CSPBGA
Number of Pins 256 324
JESD-609 Code e1 e1
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Number of Terminations 256 324
ECCN Code EAR99 3A991.D
Max Operating Temperature 100°C -
Min Operating Temperature -40°C -
Subcategory Field Programmable Gate Arrays Field Programmable Gate Arrays
Terminal Position BOTTOM BOTTOM
Terminal Form BALL BALL
Peak Reflow Temperature (Cel) 260 260
Terminal Pitch 1mm 0.8mm
Time@Peak Reflow Temperature-Max (s) 30 -
Number of Outputs 186 226
Qualification Status Not Qualified Not Qualified
Operating Supply Voltage 1.2V 1.2V
Number of I/O 186 226
RAM Size 72kB 117kB
Clock Frequency 62.5MHz -
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 14579 24051
Screening Level AEC-Q100 -
Number of Logic Blocks (LABs) 1139 -
Speed Grade 3 2
Number of Registers 18224 30064
RoHS Status RoHS Compliant ROHS3 Compliant
Factory Lead Time - 10 Weeks
Mounting Type - Surface Mount
Operating Temperature - -40°C~100°C TJ
Packaging - Tray
Published - 2008
Series - Automotive, AEC-Q100, Spartan®-6 LX XA
Part Status - Active
Terminal Finish - Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Voltage - Supply - 1.14V~1.26V
Reflow Temperature-Max (s) - 30
Base Part Number - XA6SLX25
Total RAM Bits - 958464
Number of LABs/CLBs - 1879
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