| Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product! |
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| Part Number: |
56F721-012 |
56F712-005 |
| Manufacturer: |
API Technologies Corp |
API Technologies Corp |
| Description: |
CONN MICRO-D PLUG |
700 Series D-Sub Plug, Male Pins 15-Position Male Signal Solder 2 DA A Through Hole, Right Angle Copper Alloy Gold Zinc Die Cast, Nickel Plated |
| Quantity Available: |
Available |
Available |
| Datasheets: |
-
|
-
|
| Contact Material |
Copper Alloy |
Copper Alloy |
| Mounting Type |
Free Hanging (In-Line) |
Through Hole, Right Angle |
| Number of Pins |
25 |
- |
| Dielectric Material |
Polyester, Glass Filled |
Polyester, Glass Filled |
| Shell Material, Finish |
Zinc Die Cast, Nickel Plated |
Zinc Die Cast, Nickel Plated |
| Operating Temperature |
-55°C~125°C |
-55°C~125°C |
| Packaging |
Tray |
Tray |
| Series |
700 |
700 |
| Published |
2014 |
2007 |
| Feature |
Filter |
Filter |
| Part Status |
Discontinued |
Discontinued |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
1 (Unlimited) |
| Termination |
Solder Cup |
Solder |
| Connector Type |
Plug, Male Pins |
Plug, Male Pins |
| Number of Positions |
25 |
15 |
| Number of Rows |
2 |
2 |
| Voltage - Rated |
200V |
50V |
| Contact Type |
Signal |
Signal |
| Current Rating (Amps) |
5A |
5A |
| Contact Finish |
Gold |
Gold |
| Flange Feature |
Housing/Shell (Unthreaded) |
Housing/Shell (Unthreaded) |
| Connector Style |
D-Sub |
D-Sub |
| Shell Size, Connector Layout |
3 DB B |
2 DA A |
| Contact Finish Thickness |
15.0μin 0.38μm |
15.0μin 0.38μm |
| Material Flammability Rating |
UL94 V-0 |
UL94 V-0 |
| RoHS Status |
RoHS Compliant |
RoHS Compliant |
| Contact Plating |
- |
Gold |
| Package / Case |
- |
Metal |
| Body Material |
- |
Metal |
| Gender |
- |
Male |
| Capacitance |
- |
4nF |
| Current Rating |
- |
5A |
| Number of Contacts |
- |
15 |
| Contact Gender |
- |
Male |
| Plating |
- |
Nickel |
| Backset Spacing |
- |
0.590 (14.99mm) |
| REACH SVHC |
- |
No SVHC |
| Submit RFQ: |
Submit |
Submit |
