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Part Number: |
50864-8 |
50864-5 |
Manufacturer: |
TE Connectivity AMP Connectors |
TE Connectivity AMP Connectors |
Description: |
CONN PIN RCPT .026-.033 SOLDER |
CONN PIN RCPT .026-.033 SOLDER |
Quantity Available: |
Available |
Available |
Datasheets: |
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|
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Factory Lead Time |
8 Weeks |
19 Weeks |
Contact Material |
Beryllium Copper |
Beryllium Copper |
Mount |
Surface Mount |
Surface Mount |
Mounting Hole Diameter |
0.062 ~ 0.063 (1.57mm ~ 1.60mm) |
0.062 ~ 0.063 (1.57mm ~ 1.60mm) |
Operating Temperature |
-65°C~126°C |
-65°C~126°C |
Packaging |
Bulk |
Bulk |
Published |
2007 |
2006 |
Feature |
Open Bottom |
Open Bottom |
Part Status |
Obsolete |
Active |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
1 (Unlimited) |
Termination |
Solder |
Solder |
Connector Type |
INTERCONNECTION DEVICE |
Socket |
Orientation |
Straight |
Straight |
Contact Finish |
Tin |
Gold |
Number of Contacts |
1 |
- |
Hole Diameter |
1.6002 mm |
1.6002 mm |
Flange Diameter |
0.080 (2.03mm) |
0.080 (2.03mm) |
Tail Type |
No Tail |
No Tail |
Accepts Pin Diameter |
0.026 ~ 0.033 (0.66mm ~ 0.84mm) |
0.026 ~ 0.033 (0.66mm ~ 0.84mm) |
Socket Depth |
0.244 6.20mm |
0.244 6.20mm |
Length |
6.5278mm |
6.5278mm |
Contact Finish Thickness |
100.0μin 2.54μm |
30.0μin 0.76μm |
Length - Overall |
0.257 6.53mm |
0.257 6.53mm |
Diameter - Inside |
840 μm |
840 μm |
Radiation Hardening |
No |
- |
RoHS Status |
Non-RoHS Compliant |
Non-RoHS Compliant |
Lead Free |
Contains Lead |
Contains Lead |
Lifecycle Status |
- |
ACTIVE (Last Updated: 5 days ago) |
Number of Rows |
- |
1 |
Depth |
- |
2.03mm |
ELV |
- |
Compliant |
Max Current Rating |
- |
6.5A |
Wire/Cable Type |
- |
Discrete |
Wire/Cable Gauge |
- |
20 AWG |
Sealable |
- |
No |
Contact Current Rating |
- |
6.5A |
Circuit Application |
- |
Power |
Plating Thickness |
- |
30μm |
PCB Thickness |
- |
3.18mm |
Submit RFQ: |
Submit |
Submit |