Part Number: SF2W008S9DE vs SF2W006S9CE
| Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product! |  |
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|---|---|---|
| Part Number: | SF2W008S9DE | SF2W006S9CE |
| Manufacturer: | JAE Electronics | JAE Electronics |
| Description: | CONN SIM CARD PUSH-PULL R/A SMD | CONN SIM CARD PUSH-PULL R/A SMD |
| Quantity Available: | Available | Available |
| Datasheets: | - | - |
| Factory Lead Time | 14 Weeks | 12 Weeks |
| Contact Material | Copper | - |
| Contact Plating | Gold | - |
| Mount | Surface Mount | - |
| Mounting Type | Surface Mount, Right Angle | - |
| Package / Case | SMD/SMT | - |
| Mounting Feature | Normal, Standard - Top | - |
| Housing Material | Polyphenylene | - |
| Packaging | Bulk | - |
| Series | SF2 | - |
| Feature | Board Guide | - |
| Part Status | Active | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) |
| Connector Type | Connector | - |
| Number of Positions | 8 | - |
| Max Operating Temperature | 60°C | - |
| Min Operating Temperature | -20°C | - |
| Color | Black | - |
| Pitch | 1.27mm | - |
| Current Rating | 1A | - |
| Contact Finish | Gold | - |
| Number of Contacts | 50 | - |
| Card Type | SIM Card | - |
| Insulation Resistance | 1GOhm | - |
| Insertion, Removal Method | Push In, Pull Out | - |
| Contact Finish Thickness | 1.18μin 0.030μm | - |
| RoHS Status | RoHS Compliant | RoHS Compliant |
| Flammability Rating | UL94 V-0 | - |
| Submit RFQ: | Submit | Submit |
| Image | Part Number | Manufacturer | Description | Compare |
|---|---|---|---|---|
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SF2W008S9DE | JAE Electronics | CONN SIM CARD PUSH-PULL R/A SMD | Compare |
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SF2W006S4KE3000 | JAE Electronics | CONN SIM CARD PUSH-PULL R/A SMD | Compare |
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SF2W006S9AE1000E | JAE Electronics | CONN SIM CARD PUSH-PULL R/A SMD | Compare |
