Part Number: XC17S30XLVO8C vs XC17128EPD8I

Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product!
Part Number: XC17S30XLVO8C XC17128EPD8I
Manufacturer: Xilinx Inc. Xilinx Inc.
Description: IC 3V PROM SER 300K 8-SOIC IC PROM SER I-TEMP 128K 8-DIP
Quantity Available: Available Available
Datasheets: - -
Mounting Type Surface Mount Through Hole
Package / Case 8-SOIC (0.154, 3.90mm Width) 8-DIP (0.300, 7.62mm)
Surface Mount YES NO
Number of Pins 8 8
Operating Temperature 0°C~70°C -40°C~85°C
Packaging Tube Tube
Published 1999 2000
JESD-609 Code e0 e0
Pbfree Code no -
Part Status Obsolete Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited) Not Applicable
Number of Terminations 8 8
ECCN Code EAR99 EAR99
Technology CMOS CMOS
Voltage - Supply 3V~3.6V 4.5V~5.5V
Terminal Position DUAL DUAL
Terminal Form GULL WING -
Peak Reflow Temperature (Cel) 225 225
Number of Functions 1 1
Supply Voltage 3.3V 5V
Terminal Pitch 1.27mm 2.54mm
Reach Compliance Code not_compliant not_compliant
Reflow Temperature-Max (s) 30 30
Base Part Number XC17S30XL XC17128E
Pin Count 8 8
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6V 5.5V
Power Supplies 3.3V 5V
Supply Voltage-Min (Vsup) 3V 4.5V
Programmable Type OTP OTP
Memory Size 300kb 128kb
Operating Mode SYNCHRONOUS SYNCHRONOUS
Clock Frequency 10MHz 15MHz
Supply Current-Max 0.005mA 0.01mA
Output Characteristics 3-STATE 3-STATE
Memory Width 1 1
Standby Current-Max 0.00005A 0.00005A
I/O Type COMMON COMMON
Memory IC Type MEMORY CIRCUIT CONFIGURATION MEMORY
Height Seated (Max) 1.2mm 4.5974mm
Length 4.9mm 9.3599mm
Width 3.9mm 7.62mm
RoHS Status Non-RoHS Compliant Non-RoHS Compliant
Lead Free Contains Lead Contains Lead
Additional Feature - USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Memory Density - 131072 bit
Parallel/Serial - SERIAL
Submit RFQ: Submit Submit