Part Number: W972GG8JB-3 vs W972GG8KS-25
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| Part Number: | W972GG8JB-3 | W972GG8KS-25 |
| Manufacturer: | Winbond Electronics | Winbond Electronics |
| Description: | IC SDRAM 2GBIT 333MHZ 60BGA | Memory IC 9.5mm mm |
| Quantity Available: | Available | Available |
| Datasheets: | - | - |
| Mount | Surface Mount | - |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 60-TFBGA | 60-TFBGA |
| Number of Pins | 60 | - |
| Operating Temperature | 0°C~85°C TC | 0°C~85°C TC |
| Packaging | Tray | Tray |
| Published | 2015 | - |
| Part Status | Obsolete | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| Number of Terminations | 60 | 60 |
| ECCN Code | EAR99 | EAR99 |
| Additional Feature | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| HTS Code | 8542.32.00.36 | - |
| Technology | SDRAM - DDR2 | SDRAM - DDR2 |
| Voltage - Supply | 1.7V~1.9V | 1.7V~1.9V |
| Terminal Position | BOTTOM | BOTTOM |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | - |
| Number of Functions | 1 | 1 |
| Supply Voltage | 1.8V | 1.8V |
| Terminal Pitch | 0.8mm | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | - |
| Pin Count | 60 | - |
| Qualification Status | Not Qualified | - |
| Operating Supply Voltage | 1.8V | - |
| Supply Voltage-Max (Vsup) | 1.9V | 1.9V |
| Supply Voltage-Min (Vsup) | 1.7V | 1.7V |
| Memory Size | 2Gb 256M x 8 | 2Gb 256M x 8 |
| Number of Ports | 1 | 1 |
| Nominal Supply Current | 120mA | - |
| Memory Type | Volatile | Volatile |
| Operating Mode | SYNCHRONOUS | SYNCHRONOUS |
| Clock Frequency | 333MHz | 400MHz |
| Access Time | 450ps | 400ps |
| Memory Format | DRAM | DRAM |
| Memory Interface | Parallel | Parallel |
| Organization | 256MX8 | 256MX8 |
| Output Characteristics | 3-STATE | - |
| Memory Width | 8 | 8 |
| Write Cycle Time - Word, Page | 15ns | 15ns |
| Address Bus Width | 18b | - |
| Density | 2 Gb | - |
| Standby Current-Max | 0.012A | - |
| Max Frequency | 667MHz | - |
| I/O Type | COMMON | - |
| Refresh Cycles | 8192 | - |
| Sequential Burst Length | 48 | - |
| Interleaved Burst Length | 48 | - |
| Height Seated (Max) | 1.2mm | 1.2mm |
| Length | 11.5mm | 9.5mm |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Factory Lead Time | - | 10 Weeks |
| Surface Mount | - | YES |
| JESD-30 Code | - | R-PBGA-B60 |
| Memory Density | - | 2147483648 bit |
| Width | - | 8mm |
| Submit RFQ: | Submit | Submit |
| Image | Part Number | Manufacturer | Description | Compare |
|---|---|---|---|---|
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W972GG8KS-18 | Winbond Electronics | Memory IC 9.5mm mm | Compare |
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W972GG6KB25I TR | Winbond Electronics | Memory IC | Compare |
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W972GG8KS25I TR | Winbond Electronics | Memory IC | Compare |
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W972GG8KS25I | Winbond Electronics | Memory IC 9.5mm mm | Compare |
