Part Number: IS61QDB24M18A-300M3L vs IS61DDB24M18A-300M3L

Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product!
Part Number: IS61QDB24M18A-300M3L IS61DDB24M18A-300M3L
Manufacturer: ISSI, Integrated Silicon Solution Inc ISSI, Integrated Silicon Solution Inc
Description: IC SRAM 72MBIT 300MHZ 165BGA 165 Pin Memory IC 17mm mm
Quantity Available: Available Available
Datasheets: - -
Factory Lead Time 12 Weeks 12 Weeks
Mounting Type Surface Mount Surface Mount
Package / Case 165-LBGA 165-LBGA
Surface Mount YES YES
Number of Pins 165 165
Operating Temperature 0°C~70°C TA 0°C~70°C TA
Packaging Tray Tray
Part Status Active Active
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Number of Terminations 165 165
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Technology SRAM - Synchronous, QUAD SRAM - Synchronous, DDR II
Voltage - Supply 1.71V~1.89V 1.71V~1.89V
Terminal Position BOTTOM BOTTOM
Number of Functions 1 1
Supply Voltage 1.8V 1.8V
Terminal Pitch 1mm 1mm
Pin Count 165 165
Operating Supply Voltage 1.8V -
Supply Voltage-Max (Vsup) 1.89V 1.89V
Supply Voltage-Min (Vsup) 1.71V 1.71V
Memory Size 72Mb 4M x 18 72Mb 4M x 18
Number of Ports 2 -
Nominal Supply Current 750mA -
Memory Type Volatile Volatile
Clock Frequency 300MHz 300MHz
Access Time 1.48ns -
Memory Format SRAM SRAM
Memory Interface Parallel Parallel
Organization 4MX18 4MX18
Output Characteristics 3-STATE -
Memory Width 18 18
Address Bus Width 21b -
Density 72 Mb -
I/O Type SEPARATE -
Sync/Async Synchronous -
Word Size 18b -
Standby Voltage-Min 1.7V -
Height Seated (Max) 1.4mm 1.4mm
Length 17mm 17mm
Radiation Hardening No -
RoHS Status ROHS3 Compliant ROHS3 Compliant
ECCN Code - 3A991.B.2.A
HTS Code - 8542.32.00.41
Peak Reflow Temperature (Cel) - NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) - NOT SPECIFIED
Memory Density - 75497472 bit
Access Time (Max) - 0.45 ns
Width - 15mm
Submit RFQ: Submit Submit