Part Number: TLV3494AIDR vs TLV3011AIDCKT

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Part Number: TLV3494AIDR TLV3011AIDCKT
Manufacturer: Texas Instruments Texas Instruments
Description: IC COMPARATOR P-P NANOPWR 14SOIC Low-power comparator with reference (open-drain)
Quantity Available: Available Available
Datasheets: - tlv3011
Mount Surface Mount Surface Mount
Mounting Type Surface Mount Surface Mount
Package / Case 14-SOIC (0.154, 3.90mm Width) 6-TSSOP, SC-88, SOT-363
Number of Pins 14 6
Operating Temperature -40°C~125°C -40°C~125°C
Packaging Tape & Reel (TR) Cut Tape (CT)
Pbfree Code yes yes
Part Status Obsolete Active
Moisture Sensitivity Level (MSL) 2 (1 Year) 1 (Unlimited)
Number of Terminations 14 6
ECCN Code EAR99 EAR99
Subcategory Comparator Comparator
Terminal Position DUAL DUAL
Terminal Form GULL WING GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Number of Functions 4 1
Supply Voltage 5V 5V
Terminal Pitch 1.27mm -
Reflow Temperature-Max (s) NOT SPECIFIED -
Base Part Number TLV3494 TLV3011
Pin Count 14 6
Qualification Status Not Qualified -
Output Type CMOS, Push-Pull, Rail-to-Rail Open Drain
Number of Elements 4 1
Power Supplies 2/5V 2/5V
Nominal Supply Current 1.2μA 5μA
Output Current 5mA 500μA
Max Supply Current 1.2μA 5μA
Propagation Delay 13.5 μs 13.5 μs
Quiescent Current 1.2μA 5μA
Response Time 12000 ns 12000 ns
Common Mode Rejection Ratio 74 dB 74 dB
Voltage - Supply, Single/Dual (±) 1.8V~5.5V 1.8V~5.5V
Input Offset Voltage (Vos) 15mV 12mV
Average Bias Current-Max (IIB) 0.00001μA -
Power Supply Rejection Ratio (PSRR) 69.12dB 80dB
Supply Voltage Limit-Max 5.5V 7V
Max Input Current 10pA 10pA
Input Bias Current 10pA 10pA
Voltage - Input Offset (Max) 15mV @ 5.5V 12mV @ 5.5V
Current - Input Bias (Max) 10pA @ 5.5V 10pA @ 5.5V
CMRR, PSRR (Typ) 74dB CMRR, 69.12dB PSRR 74dB CMRR, 80dB PSRR
Height Seated (Max) 1.75mm -
Length 8.65mm 2mm
Width 3.9mm 1.25mm
RoHS Status ROHS3 Compliant ROHS3 Compliant
Factory Lead Time - 6 Weeks
Lifecycle Status - ACTIVE (Last Updated: 3 days ago)
JESD-609 Code - e4
Termination - SMD/SMT
Terminal Finish - Nickel/Palladium/Gold (Ni/Pd/Au)
Packing Method - TR
Technology - CMOS
Height - 1.1mm
Thickness - 900μm
Radiation Hardening - No
REACH SVHC - No SVHC
Lead Free - Lead Free
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