GW JTLPS1.CM-JLJN-XX55-1-150-R33
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OSRAM Opto Semiconductors Inc. GW JTLPS1.CM-JLJN-XX55-1-150-R33

Part Number:
GW JTLPS1.CM-JLJN-XX55-1-150-R33
Manufacturer:
OSRAM Opto Semiconductors Inc.
Ventron No:
7312720-GW JTLPS1.CM-JLJN-XX55-1-150-R33
Description:
GW JTLPS1.CM-JLJN-XX55-1-150-R33 datasheet pdf and LED Lighting - White product details from OSRAM Opto Semiconductors Inc. stock available at Ventron
ECAD Model:
Datasheet:
GW JTLPS1.CM~
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Specifications
OSRAM Opto Semiconductors Inc. GW JTLPS1.CM-JLJN-XX55-1-150-R33 technical specifications, attributes, parameters and parts with similar specifications to OSRAM Opto Semiconductors Inc. GW JTLPS1.CM-JLJN-XX55-1-150-R33.
  • Factory Lead Time
    7 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    1113 (2835 Metric)
  • Thermal Resistance of Package
    26.7°C/W
  • Packaging
    Tape & Reel (TR)
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    DURIS® E 2835
  • Size / Dimension
    0.126Lx0.110W 3.20mmx2.80mm
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Color
    White, Neutral
  • Voltage - Forward (Vf) (Typ)
    3.06V
  • Viewing Angle
    120°
  • Current - Test
    150mA
  • Lumens/Watt @ Current - Test
    126 lm/W
  • CCT (K)
    4000K
  • CRI (Color Rendering Index)
    90
  • Current - Max
    250mA
  • Flux @ 25°C, Current - Test
    58lm 52lm~64lm
  • Height Seated (Max)
    0.030 0.75mm
  • RoHS Status
    ROHS3 Compliant
Description
GW JTLPS1.CM-JLJN-XX55-1-150-R33 Overview
The product features the brand OSRAM Opto Semiconductors Inc., representing an advanced LED Lighting - White electronic component within its respective category. It is characterized by its surface mount installation method and boasts a thermal resistance package of 26.7°C/W. This component is packaged using a tape and reel (TR) method and has dimensions measuring 0.126Lx0.110W, with a current test value of 150mA. It exhibits an impressive Lumens/Watt @ Current - Test result of 126 lm/W, while maintaining a high Color Rendering Index (CRI) at 90. Its maximum current capacity reaches up to 250mA, and it provides a Flux @ 25°C of 58lm 52lm~64lm. Lastly, it has a Height Seated (Max) measurement of 0.030 0.75mm, adding to its overall dimensions.
GW JTLPS1.CM-JLJN-XX55-1-150-R33 More Descriptions
- Pre-ordered transistors ROHS
DURIS E 2835 4000K
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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