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Maxim Integrated DS1350WP-100IND+

Part Number:

DS1350WP-100IND+

Manufacturer:

Maxim Integrated

Ventron No:

7499455-DS1350WP-100IND+

Description:

34 Pin Memory IC DS1350W 4 Mb kb

Datasheet:

DS1350WP-100IND+

Payment:

Payment

Delivery:

Delivery

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Specifications

Maxim Integrated DS1350WP-100IND+ technical specifications, attributes, parameters and parts with similar specifications to Maxim Integrated DS1350WP-100IND+.

  • Factory Lead Time
    11 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    34-PowerCap™ Module
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    34
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2000
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Number of Terminations
    34
  • ECCN Code
    3A991.B.2.A
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8473.30.11.40
  • Subcategory
    SRAMs
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    NVSRAM (Non-Volatile SRAM)
  • Voltage - Supply
    3V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3.3V
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    100GHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    DS1350W
  • Pin Count
    34
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    3.3V
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    3V
  • Memory Size
    4Mb 512K x 8
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Supply Current-Max
    0.05mA
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    NVSRAM
  • Memory Interface
    Parallel
  • Data Bus Width

    Data Bus Width refers to the number of bits that can be transmitted simultaneously on a data bus. It determines the amount of data that can be transferred between components in a single operation. A wider data bus allows for faster data transfer rates and higher system performance. Common data bus widths include 8, 16, 32, and 64 bits, with wider buses typically found in high-performance systems.

    8b
  • Organization
    512KX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    100ns
  • Density
    4 Mb
  • Standby Current-Max
    0.00015A
  • Access Time (Max)
    100 ns
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Description

DS1350WP-100IND+ Overview
As far as its memory type goes, it falls into the Non-Volatile category. You can get memory ics in a Tray case. 34-PowerCap™ Module case encloses it. There is 4Mb 512K x 8 of memory on the chip. The device uses a mainstream NVSRAM-format memory. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. There is a voltage range of 3V~3.6V for the supply voltage. It is recommended that the mounting type be Surface Mount. There are 34 terminations on the chip. There are 1 functions supported by this part as part of the comprehensive working process. The memory device is designed to be supplied with an 3.3V volt power supply in order to operate properly. When choosing similar parts, DS1350W is frequently referred to as the device's base part number. In this ic memory chip, there is an 34-pin package that encloses the device. It is worth noting that this memory device has 34 pins, which indicates it has 34 memory locations. This memory chip has an operating supply voltage of 3.3V. The device is able to run from a max supply current of 0.05mA , so it can be used in any environment. There is a common misconception that this component is a type of SRAMs. There is an 100GHz frequency with which this memory chip processes data.

DS1350WP-100IND+ Features
Package / Case: 34-PowerCap™ Module
34 Pins
Operating Supply Voltage:3.3V
Freguency at 100GHz
100GHz terminals


DS1350WP-100IND+ Applications
There are a lot of Maxim Integrated
DS1350WP-100IND+ Memory applications.


multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
DS1350WP-100IND+ More Descriptions
3A991.B.2.A Surface Mount DS1350W Tray ic memory 100GHz 100ns 0.00015A 4Mb
3.3V 4096K Nonvolatile SRAM with Battery Monitor
IC NVSRAM 4M PARALLEL 34PWRCAP

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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