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Maxim Integrated DS1265AB-70IND+

Part Number:

DS1265AB-70IND+

Manufacturer:

Maxim Integrated

Ventron No:

7499456-DS1265AB-70IND+

Description:

5V V 36 Pin Memory IC DS1265AB

Datasheet:

DS1265AB-70IND+

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Delivery:

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Specifications

Maxim Integrated DS1265AB-70IND+ technical specifications, attributes, parameters and parts with similar specifications to Maxim Integrated DS1265AB-70IND+.

  • Factory Lead Time
    10 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Through Hole
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    36-DIP Module (0.600, 15.24mm)
  • Surface Mount
    NO
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tube
  • Published
    2004
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    36
  • ECCN Code
    3A991.B.2.A
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8473.30.11.40
  • Subcategory
    SRAMs
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    NVSRAM (Non-Volatile SRAM)
  • Voltage - Supply
    4.75V~5.25V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Terminal Pitch
    2.54mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    DS1265AB
  • Pin Count
    36
  • JESD-30 Code
    R-XDMA-P36
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    5.25V
  • Power Supplies
    5V
  • Supply Voltage-Min (Vsup)
    4.75V
  • Memory Size
    8Mb 1M x 8
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Supply Current-Max
    0.085mA
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    NVSRAM
  • Memory Interface
    Parallel
  • Organization
    1MX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    70ns
  • Standby Current-Max
    0.0002A
  • Memory Density
    8388608 bit
  • Access Time (Max)
    70 ns
  • RoHS Status
    ROHS3 Compliant

Description

DS1265AB-70IND+ Overview
There is a memory type Non-Volatile for this type of device. The case comes in the Tube style. The file is embedded in a 36-DIP Module (0.600, 15.24mm) case. This chip has an 8Mb 1M x 8 size of memory on it, so a lot of data can be stored on it. Memory data is stored in NVSRAM-format, which is common in mainstream devices. -40°C~85°C TA is an extended operating temperature range, making this device ideal for demanding applications. A supply voltage of 4.75V~5.25V can be applied to it. There is a recommended mounting type of Through Hole for it. The chip contains 36 terminations. As many as 1 functions are supported for comprehensive working. An 5V supply is required for this ic memory chip to operate properly. As the base part number for the device, DS1265AB is frequently used to select similar items. The memory device has 36 pins, which means that it has 36 memory locations, which indicates it is an 36-bit device. The power supply needed for this memory chip is only 5V . This device can be operated from a maximum supply current of 0.085mA under ideal conditions. The component is usually referred to as a type of SRAMs.

DS1265AB-70IND+ Features
Package / Case: 36-DIP Module (0.600, 15.24mm)


DS1265AB-70IND+ Applications
There are a lot of Maxim Integrated
DS1265AB-70IND+ Memory applications.


personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
DS1265AB-70IND+ More Descriptions
DS1265AB Series 8 Mb (1M x 8) 5.25 V Surface Mount Nonvolatile SRAM - EDIP-36
3A991.B.2.A Through Hole DS1265AB Tube ic memory 70ns 2.54mm 0.0002A 8388608bit
NVRAM NVSRAM Parallel 8M-Bit 5V 36-Pin EDIP
IC FLASH 256M PARALLEL 64EASYBGA
IC NVSRAM 8MBIT PARALLEL 36EDIP

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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