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Maxim Integrated DS1245W-100IND+

Part Number:

DS1245W-100IND+

Manufacturer:

Maxim Integrated

Ventron No:

7499463-DS1245W-100IND+

Description:

3.3V V 32 Pin Memory IC DS1245W

Datasheet:

DS1245W-100IND+

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Delivery:

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Specifications

Maxim Integrated DS1245W-100IND+ technical specifications, attributes, parameters and parts with similar specifications to Maxim Integrated DS1245W-100IND+.

  • Factory Lead Time
    11 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Through Hole
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    32-DIP Module (0.600, 15.24mm)
  • Surface Mount
    NO
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tube
  • Published
    2004
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    32
  • ECCN Code
    3A991.B.2.A
  • Terminal Finish
    MATTE TIN
  • Additional Feature
    10 YEAR DATA RETENTION
  • HTS Code
    8473.30.11.40
  • Subcategory
    SRAMs
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    NVSRAM (Non-Volatile SRAM)
  • Voltage - Supply
    3V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3.3V
  • Terminal Pitch
    2.54mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    DS1245W
  • Pin Count
    32
  • JESD-30 Code
    R-XDMA-P32
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3V
  • Memory Size
    1Mb 128K x 8
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Non-Volatile
  • Operating Mode
    ASYNCHRONOUS
  • Supply Current-Max
    0.05mA
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    NVSRAM
  • Memory Interface
    Parallel
  • Organization
    128KX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    100ns
  • Standby Current-Max
    0.00025A
  • Memory Density
    1048576 bit
  • Access Time (Max)
    100 ns
  • RoHS Status
    ROHS3 Compliant

Description

DS1245W-100IND+ Overview
As far as memory types are concerned, Non-Volatile is considered to be its memory type. In addition, memory ics is available in a Tube case as well. In the case of 32-DIP Module (0.600, 15.24mm), it is embedded within the case. A memory chip with a capacity of 1Mb 128K x 8 is used on this device. There is a mainstream memory format used by this device, which is called NVSRAM-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 3V~3.6V. As far as the mounting type is concerned, Through Hole is recommended. On the chip, there are 32 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 3.3V. In order to select similar parts, typical manufacturers refer to DS1245W as the device's base part number. I have noticed that the memory device has 32 pins, which indicates that it has 32 locations in the memory. The memory chip also offers 10 YEAR DATA RETENTION to level up system performance despite its merits. There is only a single power supply required for this memory chip. As far as the supply current is concerned, it can be operated with a maximum of 0.05mA of currentIn most cases, this memory ics is regarded as being a type of SRAMs.

DS1245W-100IND+ Features
Package / Case: 32-DIP Module (0.600, 15.24mm)
Additional Feature:10 YEAR DATA RETENTION


DS1245W-100IND+ Applications
There are a lot of Maxim Integrated
DS1245W-100IND+ Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
DS1245W-100IND+ More Descriptions
3A991.B.2.A Through Hole DS1245W Tube ic memory 100ns 2.54mm 0.00025A 1048576bit
NVRAM NVSRAM Parallel 1M-Bit 3.3V 32-Pin EDIP
IC NVSRAM 1MBIT PARALLEL 32EDIP

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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