AVX Corporation CDR32BP681BKWS-1K
Part Number:
- CDR32BP681BKWS-1K
Manufacturer:
- AVX Corporation
Ventron No:
- 8022181-CDR32BP681BKWS-1K
Description:
- Ceramic Capacitor
Datasheet:
- CDR32BP681BKWS-1K
Payment:

Delivery:


One Stop Service

Competitive Price

Source Traceability

Same Day Delivery
Specifications
AVX Corporation CDR32BP681BKWS-1K technical specifications, attributes, parameters and parts with similar specifications to AVX Corporation CDR32BP681BKWS-1K.
- Factory Lead Time24 Weeks
- PackagingTape & Reel (TR)
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- RoHS StatusNon-RoHS Compliant
Description
CDR32BP681BKWS-1K Overview
CDR32BP681BKWS-1K Features
CDR32BP681BKWS-1K Applications
There are a lot of AVX Corporation
CDR32BP681BKWS-1K applications of ceramic capacitors.
General electronic equipment
Mobile devices
Servers, PCs, tablets
Power supply circuit
CDR32BP681BKWS-1K Features
CDR32BP681BKWS-1K Applications
There are a lot of AVX Corporation
CDR32BP681BKWS-1K applications of ceramic capacitors.
General electronic equipment
Mobile devices
Servers, PCs, tablets
Power supply circuit
CDR32BP681BKWS-1K More Descriptions
Cap Ceramic 680pF 100V C0G 10% 1206 Bulk
CAP CER SMP MLC HI-REL
CAP CER SMP MLC HI-REL
Product Comparison
The three parts on the right have similar specifications to CDR32BP681BKWS-1K.
-
ImagePart NumberManufacturerFactory Lead TimePackagingPart StatusMoisture Sensitivity Level (MSL)RoHS StatusPublishedView Compare
-
CDR32BP681BKWS-1K24 WeeksTape & Reel (TR)Active1 (Unlimited)Non-RoHS Compliant-- -
22 WeeksTape & Reel (TR)Active1 (Unlimited)Non-RoHS Compliant2015 -
22 Weeks-Active1 (Unlimited)Non-RoHS Compliant2015 -
22 Weeks-Active1 (Unlimited)Non-RoHS Compliant2015
Certification
Popular Search Part Number
Search Tags
Latest News
-
29 March 2024TLP2362 Optocoupler Characteristics, Specifications, Working Principle and MoreⅠ. Overview of TLP2362Ⅱ. Characteristics of TLP2362Ⅲ. Specifications of TLP2362Ⅳ. Recommended operating conditions of TLP2362Ⅴ. How does TLP2362 work?Ⅵ. Internal equivalent circuit of TLP2362Ⅶ. Storage and soldering of...
-
29 March 2024STM32H743VIT6 Specifications, Characteristics, Pinout and Market SituationⅠ. Description of STM32H743VIT6Ⅱ. Specifications of STM32H743VIT6Ⅲ. Characteristics of STM32H743VIT6Ⅳ. How to use STM32H743VIT6?Ⅴ. STM32H743VIT6 pinoutⅥ. Low-power strategy of STM32H743VIT6Ⅶ. Market situation of STM32H743VIT6Ⅰ. Description of STM32H743VIT6The STM32H743VIT6...
-
01 April 2024XCF32PFSG48C Symbol, Manufacturer, Specifications and ProgrammingⅠ. Overview of XCF32PFSG48CⅡ. Symbol, footprint and 3D model of XCF32PFSG48CⅢ. Manufacturer of XCF32PFSG48CⅣ. Reset and power-on reset activationⅤ. Specifications of XCF32PFSG48CⅥ. Programming of XCF32PFSG48CⅦ. In which emerging...
-
01 April 2024M24C16-RMN6TP Structure, Advantages, Package and Other DetailsⅠ. M24C16-RMN6TP descriptionⅡ. Basic structure and working principle of M24C16-RMN6TPⅢ. Technical parameters of M24C16-RMN6TPⅣ. What are the market competitive advantages of M24C16-RMN6TP?Ⅴ. Package of M24C16-RMN6TPⅥ. Data transmission process...
