Xilinx Inc. XCZU9EG-L1FFVB1156I

Name: XCZU9EG-L1FFVB1156I
Brand: Xilinx Inc.
SKU: 3669001-XCZU9EG-L1FFVB1156I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU9EG-L1FFVB1156I

Manufacturer:: Xilinx Inc.

Ventron No:: 3669001-XCZU9EG-L1FFVB1156I

Description:: IC FPGA 328 I/O 1156FCBGA

ECAD Model:

Datasheet:: XCZU9EG-L1FFVB1156I

Specifications

Xilinx Inc. XCZU9EG-L1FFVB1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU9EG-L1FFVB1156I.

Factory Lead Time
11 Weeks
Package / Case
1156-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Bulk
Published
2013
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.72V
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B1156
Supply Voltage-Max (Vsup)
0.742V
Supply Voltage-Min (Vsup)
0.698V
Number of I/O
328
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 599K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The technology used in this publication from 2013 is CMOS, which stands for Complementary Metal-Oxide-Semiconductor. The terminal form of this technology is BALL, which refers to the shape of the terminals used in the integrated circuit. The supply voltage for this technology is 0.72V, with a minimum supply voltage of 0.698V. The reflow temperature for this technology is not specified in the original text. The speed of this technology ranges from 500MHz to 1.2GHz, providing high performance capabilities. The peripherals included in this technology are DMA (Direct Memory Access) and WDT (Watchdog Timer), enhancing the functionality and efficiency of the system. The connectivity options available with this technology include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, allowing for seamless communication and data transfer. Lastly, this technology is ROHS3 Compliant, meaning it meets the standards and regulations set forth by the Restriction of Hazardous Substances directive.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU9EG-L1FFVB1156I System On Chip (SoC) applications.

Smartphone accessories
Functional safety for critical applications in the aerospace
Digital Signal Processing
Robotics
External USB hard disk/SSD
Video Imaging
Cyber security for critical applications in the aerospace
String inverter
Cyberphysical system-on-chip
Medical Pressure

XCZU9EG-L1FFVB1156I More Descriptions

FPGA Zynq UltraScale 20nm Technology 599550 Cells 1L Speed Grade Industrial Temp 1156-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-L1, Logic Cells 600K, B1156, RoHSXilinx SCT
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU9EG-L1FFVB1156I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

View Compare
XCZU9EG-L1FFVB1156I

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

YES

-40°C~100°C TJ

Bulk

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.72V

NOT SPECIFIED

R-PBGA-B1156

0.742V

0.698V

328

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

-
XCZU7CG-2FFVC1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

360

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

yes

XCZU9EG-L1FFVB1156I vs XCZU7CG-2FFVC1156E
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

328

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

yes

XCZU9EG-L1FFVB1156I vs XCZU9CG-2FFVB1156E
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

204

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

XCZU9EG-L1FFVB1156I vs XCZU9EG-1FFVC900I