Xilinx Inc. XCZU7EG-2FBVB900I
- Part Number:
- XCZU7EG-2FBVB900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669014-XCZU7EG-2FBVB900I
- Description:
- IC FPGA 204 I/O 900FCBGA
- ECAD Model:
-
- Datasheet:
- XCZU7EG-2FBVB900I
Xilinx Inc. XCZU7EG-2FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU7EG-2FBVB900I.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed533MHz, 600MHz, 1.3GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 504K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The Xilinx Inc. brand offers a range of Embedded - System On Chip (SoC) chips, including the 900-BBGA and FCBGA packages. These chips fall under the Embedded - System On Chip (SoC) category and are packaged in trays. The part is currently in Active status and has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand up to 72 hours of exposure. Its HTS Code is 8542.31.00.01 and its Peak Reflow Temperature is not specified. With speeds of 533MHz, 600MHz, and 1.3GHz, this chip is designed for use in a variety of applications. Its architecture includes both MCU and FPGA components, and its primary attributes include the Zynq®UltraScale ™ FPGA and 504K Logic Cells. Additionally, this part is compliant with ROHS3 standards.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU7EG-2FBVB900I System On Chip (SoC) applications.
Functional safety for critical applications in the industrial sectors
Microcontroller
USB hard disk enclosure
Measurement tools
PC peripherals
Communication interfaces ( I2C, SPI )
Industrial
Keyboard
Temperature
Central inverter
The Xilinx Inc. brand offers a range of Embedded - System On Chip (SoC) chips, including the 900-BBGA and FCBGA packages. These chips fall under the Embedded - System On Chip (SoC) category and are packaged in trays. The part is currently in Active status and has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand up to 72 hours of exposure. Its HTS Code is 8542.31.00.01 and its Peak Reflow Temperature is not specified. With speeds of 533MHz, 600MHz, and 1.3GHz, this chip is designed for use in a variety of applications. Its architecture includes both MCU and FPGA components, and its primary attributes include the Zynq®UltraScale ™ FPGA and 504K Logic Cells. Additionally, this part is compliant with ROHS3 standards.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU7EG-2FBVB900I System On Chip (SoC) applications.
Functional safety for critical applications in the industrial sectors
Microcontroller
USB hard disk enclosure
Measurement tools
PC peripherals
Communication interfaces ( I2C, SPI )
Industrial
Keyboard
Temperature
Central inverter
XCZU7EG-2FBVB900I More Descriptions
FPGA Zynq UltraScale Family 504000 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 504K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 504K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU7EG-2FBVB900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusView Compare
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XCZU7EG-2FBVB900I11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant- -
11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
-
11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant
-
11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
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