Xilinx Inc. XCZU4EV-1FBVB900E
- Part Number:
- XCZU4EV-1FBVB900E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3163357-XCZU4EV-1FBVB900E
- Description:
- IC FPGA 204 I/O 900FCBGA
- ECAD Model:
-
- Datasheet:
- XCZU4EV-1FBVB900E
Xilinx Inc. XCZU4EV-1FBVB900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4EV-1FBVB900E.
- Factory Lead Time11 Weeks
- Package / Case900-BBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EV
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O204
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 192K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The package or case of this particular product is 900-BBGA or FCBGA, which refers to the type of ball grid array or flip chip ball grid array used. It is designed to operate within a temperature range of 0°C to 100°C, with a maximum junction temperature of 100°C. The moisture sensitivity level (MSL) for this product is 4, which means it can withstand exposure to ambient air for up to 72 hours. The HTS code for this product is 8542.31.00.01, which is used for classification and tariff purposes. It has a total of 204 input/output (I/O) pins and can operate at speeds of 500MHz, 600MHz, or 1.2GHz. The RAM size is 256KB, and it has a core processor that consists of a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and an ARM Mali™-400 MP2. This product also includes various peripherals such as DMA and WDT, and it is designed using an architecture of MCU or FPGA.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EV-1FBVB900E System On Chip (SoC) applications.
USB hard disk enclosure
Smart appliances
Keyboard
POS Terminals
Communication interfaces ( I2C, SPI )
Cyber security for critical applications in the aerospace
Flow Sensors
Measurement tools
Functional safety for critical applications in the industrial sectors
Robotics
The package or case of this particular product is 900-BBGA or FCBGA, which refers to the type of ball grid array or flip chip ball grid array used. It is designed to operate within a temperature range of 0°C to 100°C, with a maximum junction temperature of 100°C. The moisture sensitivity level (MSL) for this product is 4, which means it can withstand exposure to ambient air for up to 72 hours. The HTS code for this product is 8542.31.00.01, which is used for classification and tariff purposes. It has a total of 204 input/output (I/O) pins and can operate at speeds of 500MHz, 600MHz, or 1.2GHz. The RAM size is 256KB, and it has a core processor that consists of a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and an ARM Mali™-400 MP2. This product also includes various peripherals such as DMA and WDT, and it is designed using an architecture of MCU or FPGA.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU4EV-1FBVB900E System On Chip (SoC) applications.
USB hard disk enclosure
Smart appliances
Keyboard
POS Terminals
Communication interfaces ( I2C, SPI )
Cyber security for critical applications in the aerospace
Flow Sensors
Measurement tools
Functional safety for critical applications in the industrial sectors
Robotics
XCZU4EV-1FBVB900E More Descriptions
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 192K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
MPSOC, ARM CORTEX-A53/R5, FCBGA-900
Product Description Demo for Development.
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-900; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU4EV-1FBVB900E
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 192K, B900, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA900
MPSOC, ARM CORTEX-A53/R5, FCBGA-900
Product Description Demo for Development.
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53/R5, Fcbga-900; Product Range:Zynq Family Ultrascale Series Microprocessors; Cpu Speed:1.5Ghz; Core Architecture:Arm Cortex-A53, Arm Cortex-R5; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Rohs Compliant: Yes |Amd Xilinx XCZU4EV-1FBVB900E
The three parts on the right have similar specifications to XCZU4EV-1FBVB900E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU4EV-1FBVB900E11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 192K Logic CellsROHS3 Compliant------------- -
11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED328533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes-----------
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-YES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant------------
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