Xilinx Inc. XCZU2EG-1SFVA625I
- Part Number:
- XCZU2EG-1SFVA625I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3163307-XCZU2EG-1SFVA625I
- Description:
- IC FPGA 180 I/O 625FCBGA
- Datasheet:
- XCZU2EG-1SFVA625I
Xilinx Inc. XCZU2EG-1SFVA625I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2EG-1SFVA625I.
- Factory Lead Time11 Weeks
- Package / Case625-BFBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2013
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O180
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 103K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The 625-BFBGA, FCBGA package or case was published in 2013 and is currently active. It has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to moisture for up to 72 hours. The Peak Reflow Temperature is not specified. This package has 180 input/output (I/O) connections and contains a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™ processors, as well as an ARM Mali™-400 MP2. Its peripherals include DMA and WDT. This package is also RoHS3 compliant, ensuring it meets environmental standards. It is available in a tray packaging.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU2EG-1SFVA625I System On Chip (SoC) applications.
Industrial sectors
Central alarm system
Temperature Sensors
Flow Sensors
High-end PLC
AC-input BLDC motor drive
Efficient hardware for inference of neural networks
Temperature
Measurement tools
CNC control
The 625-BFBGA, FCBGA package or case was published in 2013 and is currently active. It has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to moisture for up to 72 hours. The Peak Reflow Temperature is not specified. This package has 180 input/output (I/O) connections and contains a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™ processors, as well as an ARM Mali™-400 MP2. Its peripherals include DMA and WDT. This package is also RoHS3 compliant, ensuring it meets environmental standards. It is available in a tray packaging.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU2EG-1SFVA625I System On Chip (SoC) applications.
Industrial sectors
Central alarm system
Temperature Sensors
Flow Sensors
High-end PLC
AC-input BLDC motor drive
Efficient hardware for inference of neural networks
Temperature
Measurement tools
CNC control
XCZU2EG-1SFVA625I More Descriptions
FPGA Zynq UltraScale Family 103320 Cells 20nm Technology 0.85V 625-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 103K, A625, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
IC SOC CORTEX-M3 166MHZ 536BGA
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 103K, A625, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
IC SOC CORTEX-M3 166MHZ 536BGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU2EG-1SFVA625I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU2EG-1SFVA625I11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 Compliant------------
-
11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant-----------
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11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-----------
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