Xilinx Inc. XC7Z100-1FFG900I
- Part Number:
- XC7Z100-1FFG900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162941-XC7Z100-1FFG900I
- Description:
- IC SOC CORTEX-A9 KINTEX7 900FBGA
- Datasheet:
- XC7Z100-1FFG900I
Xilinx Inc. XC7Z100-1FFG900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z100-1FFG900I.
- Factory Lead Time10 Weeks
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTube
- Published2010
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z100
- JESD-30 CodeS-PBGA-B900
- Supply Voltage-Max (Vsup)1.05V
- Supply Voltage-Min (Vsup)0.95V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O212
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Boundary ScanYES
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 444K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.35mm
- Length31mm
- Width31mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq?-7000 series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 444K Logic Cells.There is a state-of-the-art Tube package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 212 I/Os.A power supply with a 1V rating is recommended.In the SoCs wireless, voltages above 1.05V are considered unsafe.Power supply should be at least 0.95V.A system on a chip benefits from having 900 terminations.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z100.At 667MHz, the wireless SoC works.Core architecture of ARM underpins the SoC meaning.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z100-1FFG900I System On Chip (SoC) applications.
Cyberphysical system-on-chip
Mouse
Industrial AC-DC
Smartphones
Industrial transport
Functional safety for critical applications in the automotive
Keywords
Healthcare
Microcontroller
Deep learning hardware
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq?-7000 series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 444K Logic Cells.There is a state-of-the-art Tube package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 212 I/Os.A power supply with a 1V rating is recommended.In the SoCs wireless, voltages above 1.05V are considered unsafe.Power supply should be at least 0.95V.A system on a chip benefits from having 900 terminations.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z100.At 667MHz, the wireless SoC works.Core architecture of ARM underpins the SoC meaning.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z100-1FFG900I System On Chip (SoC) applications.
Cyberphysical system-on-chip
Mouse
Industrial AC-DC
Smartphones
Industrial transport
Functional safety for critical applications in the automotive
Keywords
Healthcare
Microcontroller
Deep learning hardware
XC7Z100-1FFG900I More Descriptions
MPU Zynq-7000 667MHz 900-Pin F-BGA
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-900
Processors - Application Specialized XC7Z100-1FFG900I
IC SOC CORTEX-A9 667MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z100-1FFG900I
PSOC, ARM CORTEX-A9, 667MHZ, FCBGA-900
Processors - Application Specialized XC7Z100-1FFG900I
IC SOC CORTEX-A9 667MHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 667Mhz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:667Mhz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotiverohs Compliant: Yes |Amd Xilinx XC7Z100-1FFG900I
The three parts on the right have similar specifications to XC7Z100-1FFG900I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitectureBoundary ScanRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthWidthRadiation HardeningRoHS StatusContact PlatingOperating Supply VoltageMemory TypeData Bus WidthSpeed GradeMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersView Compare
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XC7Z100-1FFG900I10 Weeks900-BBGA, FCBGAYES-40°C~100°C TJTube2010Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm667MHz30XC7Z100S-PBGA-B9001.05V0.95VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB212256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 444K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mm31mmNoROHS3 Compliant-----------
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10 Weeks676-BBGA, FCBGAYES0°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z045S-PBGA-B6761.05V-CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.37mm27mm-NoROHS3 CompliantCopper, Silver, Tin1VROMless32b-2-----
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10 Weeks676-BBGA, FCBGA-0°C~100°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676---CMOSBOTTOMBALLNOT SPECIFIED1V1mm800MHzNOT SPECIFIED-S-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mm-ROHS3 CompliantCopper, Silver, Tin---3Surface Mount1.05V950mV110 ps343800
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10 Weeks676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIED-S-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAARMYES256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm27mm-ROHS3 CompliantCopper, Silver, Tin---1Surface Mount1.05V950mV120 ps343800
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