XC7Z045-3FFG900E

XC7Z045-3FFG900E

Part Number:
XC7Z045-3FFG900E
Manufacturer:
Xilinx Inc.
Ventron No:
3162965-XC7Z045-3FFG900E
Description:
IC SOC CORTEX-A9 KINTEX7 900FBGA
ECAD Model:
Datasheet:
XC7Z045-3FFG900E

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Specifications
Xilinx Inc. XC7Z045-3FFG900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-3FFG900E.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Package / Case
    900-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Zynq®-7000
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    900
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Frequency
    1GHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC7Z045
  • JESD-30 Code
    S-PBGA-B900
  • Operating Supply Voltage
    1V
  • Supply Voltage-Max (Vsup)
    1.05V
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
  • Number of I/O
    130
  • RAM Size
    256KB
  • Memory Type
    ROMless
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Data Bus Width
    32b
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Speed Grade
    -3
  • RAM (words)
    256000
  • Primary Attributes
    Kintex™-7 FPGA, 350K Logic Cells
  • Bus Compatibility
    CAN; ETHERNET; I2C; SPI; UART; USB
  • Height Seated (Max)
    3.35mm
  • Length
    31mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Description
  • FAQs
  • Shipping
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq?-7000 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.A power supply with a 1V rating is recommended.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.As a result, there are 900 terminations in total, which does really benefit system on a chip.Search XC7Z045 for system on chips with similar specs and purposes.At 1GHz, the wireless SoC works.It uses ARM as its core architecture.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z045-3FFG900E System On Chip (SoC) applications.

Keyboard
Efficient hardware for training of neural networks
Central alarm system
Communication network-on-Chip (cNoC)
External USB hard disk/SSD
Robotics
Functional safety for critical applications in the aerospace
Industrial
Industrial sectors
Industrial automation devices
XC7Z045-3FFG900E More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 900-Pin FC-BGA
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-900
Processors - Application Specialized XC7Z045-3FFG900E
IC SOC CORTEX-A9 1GHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z045-3FFG900E
Product Comparison
The three parts on the right have similar specifications to XC7Z045-3FFG900E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Interface
    Number of I/O
    RAM Size
    Memory Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Data Bus Width
    Core Architecture
    Boundary Scan
    Speed Grade
    RAM (words)
    Primary Attributes
    Bus Compatibility
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Speed
    Mount
    Max Supply Voltage
    Min Supply Voltage
    Propagation Delay
    Number of Registers
    Width
    View Compare
  • XC7Z045-3FFG900E
    XC7Z045-3FFG900E
    10 Weeks
    Copper, Silver, Tin
    900-BBGA, FCBGA
    YES
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    900
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    1GHz
    30
    XC7Z045
    S-PBGA-B900
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    ROMless
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -3
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.35mm
    31mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-2FFG676E
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    YES
    0°C~100°C TJ
    Tray
    2009
    Zynq®-7000
    e1
    Active
    4 (72 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    CMOS
    BOTTOM
    BALL
    245
    1V
    1mm
    800MHz
    30
    XC7Z045
    S-PBGA-B676
    1V
    1.05V
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    ROMless
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    32b
    ARM
    YES
    -2
    256000
    Kintex™-7 FPGA, 350K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    3.37mm
    27mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
  • XC7Z045-3FFV676E
    10 Weeks
    -
    676-BBGA, FCBGA
    -
    0°C~100°C TJ
    Bulk
    2009
    Zynq®-7000
    -
    Active
    4 (72 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    130
    256KB
    -
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    -
    -
    -
    -
    Kintex™-7 FPGA, 350K Logic Cells
    -
    -
    -
    -
    ROHS3 Compliant
    1GHz
    -
    -
    -
    -
    -
    -
  • XC7Z035-1FBG676C
    10 Weeks
    Copper, Silver, Tin
    676-BBGA, FCBGA
    -
    0°C~85°C TJ
    Tray
    2010
    Zynq®-7000
    e1
    Active
    3 (168 Hours)
    676
    -
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    -
    667MHz
    NOT SPECIFIED
    -
    S-PBGA-B676
    -
    -
    CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
    130
    256KB
    -
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
    DMA
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    -
    ARM
    YES
    1
    256000
    Kintex™-7 FPGA, 275K Logic Cells
    CAN; ETHERNET; I2C; SPI; UART; USB
    2.54mm
    27mm
    -
    ROHS3 Compliant
    -
    Surface Mount
    1.05V
    950mV
    120 ps
    343800
    27mm
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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