XC7Z045-3FFG900E
- Part Number:
- XC7Z045-3FFG900E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3162965-XC7Z045-3FFG900E
- Description:
- IC SOC CORTEX-A9 KINTEX7 900FBGA
- Datasheet:
- XC7Z045-3FFG900E
Xilinx Inc. XC7Z045-3FFG900E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z045-3FFG900E.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2009
- SeriesZynq®-7000
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Frequency1GHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC7Z045
- JESD-30 CodeS-PBGA-B900
- Operating Supply Voltage1V
- Supply Voltage-Max (Vsup)1.05V
- InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- Memory TypeROMless
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Boundary ScanYES
- Speed Grade-3
- RAM (words)256000
- Primary AttributesKintex™-7 FPGA, 350K Logic Cells
- Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
- Height Seated (Max)3.35mm
- Length31mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Description
- FAQs
- Shipping
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq?-7000 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.A power supply with a 1V rating is recommended.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.As a result, there are 900 terminations in total, which does really benefit system on a chip.Search XC7Z045 for system on chips with similar specs and purposes.At 1GHz, the wireless SoC works.It uses ARM as its core architecture.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-3FFG900E System On Chip (SoC) applications.
Keyboard
Efficient hardware for training of neural networks
Central alarm system
Communication network-on-Chip (cNoC)
External USB hard disk/SSD
Robotics
Functional safety for critical applications in the aerospace
Industrial
Industrial sectors
Industrial automation devices
On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq?-7000 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.A power supply with a 1V rating is recommended.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.As a result, there are 900 terminations in total, which does really benefit system on a chip.Search XC7Z045 for system on chips with similar specs and purposes.At 1GHz, the wireless SoC works.It uses ARM as its core architecture.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
There are a lot of Xilinx Inc.
XC7Z045-3FFG900E System On Chip (SoC) applications.
Keyboard
Efficient hardware for training of neural networks
Central alarm system
Communication network-on-Chip (cNoC)
External USB hard disk/SSD
Robotics
Functional safety for critical applications in the aerospace
Industrial
Industrial sectors
Industrial automation devices
XC7Z045-3FFG900E More Descriptions
MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 900-Pin FC-BGA
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-900
Processors - Application Specialized XC7Z045-3FFG900E
IC SOC CORTEX-A9 1GHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z045-3FFG900E
PSOC, ARM CORTEX-A9, 1GHZ, FCBGA-900
Processors - Application Specialized XC7Z045-3FFG900E
IC SOC CORTEX-A9 1GHZ 900FCBGA
IC SOC CORTEX-A9 KINTEX7 900FBGA
Product Description Demo for Development.
Psoc, Arm Cortex-A9, 1Ghz, Fcbga-900; Product Range:Zynq Family 7000 Series Microprocessors; Cpu Speed:1Ghz; Core Architecture:Arm Cortex-A9; Mpu Case Style:Fcbga; No. Of Pins:900Pins; Mpu Family:Zynq; Mpu Series:7000; Automotive Rohs Compliant: Yes |Amd Xilinx XC7Z045-3FFG900E
The three parts on the right have similar specifications to XC7Z045-3FFG900E.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeOperating Supply VoltageSupply Voltage-Max (Vsup)InterfaceNumber of I/ORAM SizeMemory TypeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitectureBoundary ScanSpeed GradeRAM (words)Primary AttributesBus CompatibilityHeight Seated (Max)LengthRadiation HardeningRoHS StatusSpeedMountMax Supply VoltageMin Supply VoltagePropagation DelayNumber of RegistersWidthView Compare
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XC7Z045-3FFG900E10 WeeksCopper, Silver, Tin900-BBGA, FCBGAYES0°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01CMOSBOTTOMBALL2451V1mm1GHz30XC7Z045S-PBGA-B9001V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-3256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.35mm31mmNoROHS3 Compliant--------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGAYES0°C~100°C TJTray2009Zynq®-7000e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01CMOSBOTTOMBALL2451V1mm800MHz30XC7Z045S-PBGA-B6761V1.05VCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBROMlessDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMYES-2256000Kintex™-7 FPGA, 350K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB3.37mm27mmNoROHS3 Compliant-------
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10 Weeks-676-BBGA, FCBGA-0°C~100°C TJBulk2009Zynq®-7000-Active4 (72 Hours)-----------------130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-----Kintex™-7 FPGA, 350K Logic Cells----ROHS3 Compliant1GHz------
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10 WeeksCopper, Silver, Tin676-BBGA, FCBGA-0°C~85°C TJTray2010Zynq®-7000e1Active3 (168 Hours)676-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-CMOSBOTTOMBALLNOT SPECIFIED1V-667MHzNOT SPECIFIED-S-PBGA-B676--CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KB-Dual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA-ARMYES1256000Kintex™-7 FPGA, 275K Logic CellsCAN; ETHERNET; I2C; SPI; UART; USB2.54mm27mm-ROHS3 Compliant-Surface Mount1.05V950mV120 ps34380027mm
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